507-10-281-19-081437 datasheet, PDF

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507-10-281-19-081437: DescriptionIC Socket, PGA281, 281 Contact(s), ROHS COMPLIANT; CategoryThe connector socket; File Size148KB，1 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com; Environmental Compliance

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507-10-281-19-081437 Overview

IC Socket, PGA281, 281 Contact(s), ROHS COMPLIANT

507-10-281-19-081437 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Mill-Max
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	PGA HEADER
Contact to complete cooperation	GOLD (10) OVER NICKEL (150)
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact material	NOT SPECIFIED
Device slot type	IC SOCKET
Type of equipment used	PGA281
Shell material	POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
JESD-609 code	e4
Number of contacts	281

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SURFACE MOUNT PIN GRID ARRAYS

For Interstitial Patterns

Female Socket

•

Series 507 SMT Headers “float” in

a machined epoxy insulator.

•

Series 513 Interstitial PGA

surface mount sockets are available

with and without tabs for clip-on

heatsinks.

•

Mill-Max #43, “Ultra-Lite” contact

standard, see page 209 for

details.

•

Hi-Temp PCT polyester insulator

material suitable for all forms of

soldering.

Series 513

Ordering Information

HEADER PIN

TYPE 0737

FOR PGA MALE HEADER

1. Locate footprint pattern from pages 107 to 111, the middle 8 digits of

the part number will be located under the pattern.

Series

Plating

Code

Window

5 0 7

1 0

No. of pins

Grid size

Pattern #

4 3 7

Determined from footprint pattern pages 107 to 111

SPECIFY PLATING CODE XX=

10μ” Au

Pin Plating

SMT RECEPTACLE

TYPE 1385

FOR PGA FEMALE SOCKET

1. Specify 2-digit plating code from chart at bottom of page.

2. Locate footprint pattern from pages 107 to 111, the middle 8 digits of

the part number will be located under the pattern.

Series

Plating

Code

Window

5 1 3

No. of pins

Grid size

Pattern #

0 8 5

Determined from footprint pattern pages 107 to 111

SPECIFY PLATING CODE XX=

10µ” Au

30µ” Au

10µ” Au

30µ” Au

200µ”Sn/Pb

10µ” Au

Sleeve (Pin)

Contact (Clip)

200µ” Sn/Pb

200µ”Sn/Pb 200µ”Sn

200µ”Sn

30µ” Au

200µ”Sn

w w w. m i l l - m a x . c o m

105

516-922-6000

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