|
NM24C65FLN |
NM24C65FLVN |
| Description |
EEPROM, 8KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
EEPROM, 8KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Fairchild |
Fairchild |
| Parts packaging code |
DIP |
DIP |
| package instruction |
DIP, DIP8,.3 |
DIP, DIP8,.3 |
| Contacts |
8 |
8 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| Other features |
32 BYTE PAGE WRITE; DATA RETENTION = 40 YEARS |
32 BYTE PAGE WRITE; DATA RETENTION = 40 YEARS |
| Maximum clock frequency (fCLK) |
0.4 MHz |
0.4 MHz |
| Data retention time - minimum |
40 |
40 |
| Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
| I2C control byte |
1010DDDR |
1010DDDR |
| JESD-30 code |
R-PDIP-T8 |
R-PDIP-T8 |
| JESD-609 code |
e0 |
e0 |
| length |
9.817 mm |
9.817 mm |
| memory density |
65536 bit |
65536 bit |
| Memory IC Type |
EEPROM |
EEPROM |
| memory width |
8 |
8 |
| Number of functions |
1 |
1 |
| Number of terminals |
8 |
8 |
| word count |
8192 words |
8192 words |
| character code |
8000 |
8000 |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
| Maximum operating temperature |
70 °C |
125 °C |
| organize |
8KX8 |
8KX8 |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
DIP |
| Encapsulate equivalent code |
DIP8,.3 |
DIP8,.3 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
| Parallel/Serial |
SERIAL |
SERIAL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
3/5 V |
3/5 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
5.08 mm |
5.08 mm |
| Serial bus type |
I2C |
I2C |
| Maximum standby current |
0.00001 A |
0.00001 A |
| Maximum slew rate |
0.001 mA |
0.001 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
| surface mount |
NO |
NO |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
AUTOMOTIVE |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
7.62 mm |
7.62 mm |
| Maximum write cycle time (tWC) |
15 ms |
15 ms |
| write protect |
HARDWARE |
HARDWARE |