EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Rochester Electronics |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | DATA RETENTION > 40 YEARS |
| Maximum clock frequency (fCLK) | 2.1 MHz |
| Data retention time - minimum | 40 |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| length | 4.9 mm |
| memory density | 4096 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Serial bus type | SPI |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms |

| NM25C040M8X | NM25C040LM8 | NM25C040LM8X | NM25C040LMT8 | NM25C040EM8 | NM25C040LZEMT8 | NM25C040N | NM25C040LVM8 | NM25C040LZEM8 | NM25C040EN | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | DIP | SOIC | SOIC | DIP |
| package instruction | SOP, | SOP, | SOP, | TSSOP, | SOP, | TSSOP, | DIP, | SOP, | SOP, | DIP, |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS |
| Data retention time - minimum | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 4.9 mm | 4.9 mm | 4.9 mm | 4.4 mm | 4.9 mm | 4.4 mm | 9.817 mm | 4.9 mm | 4.9 mm | 9.817 mm |
| memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 125 °C | 85 °C | 85 °C |
| organize | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | TSSOP | SOP | TSSOP | DIP | SOP | SOP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 1.2 mm | 1.75 mm | 1.2 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm |
| Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 4.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 2.7 V | 2.7 V | 2.7 V | 4.5 V | 2.7 V | 4.5 V | 2.7 V | 2.7 V | 4.5 V |
| surface mount | YES | YES | YES | YES | YES | YES | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 3.9 mm | 3.9 mm | 3.9 mm | 3 mm | 3.9 mm | 3 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| Nominal supply voltage (Vsup) | 5 V | 3.3 V | 3.3 V | - | 5 V | 3.3 V | 5 V | 3.3 V | 3.3 V | 5 V |