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LH2011CD

Description
IC,OP-AMP,DUAL,HYBRID,DIP,16PIN,CERAMIC
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size439KB,13 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LH2011CD Overview

IC,OP-AMP,DUAL,HYBRID,DIP,16PIN,CERAMIC

LH2011CD Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Codecompliant
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
frequency compensationYES
Maximum input offset voltage1300 µV
JESD-30 codeR-XDIP-T16
JESD-609 codee0
low-biasYES
low-dissonanceNO
Number of functions2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyHYBRID
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

LH2011CD Related Products

LH2011CD LH2011F
Description IC,OP-AMP,DUAL,HYBRID,DIP,16PIN,CERAMIC IC,OP-AMP,DUAL,HYBRID,FP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible
Maker National Semiconductor(TI ) National Semiconductor(TI )
Reach Compliance Code compliant compliant
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
frequency compensation YES YES
Maximum input offset voltage 1300 µV 600 µV
JESD-30 code R-XDIP-T16 R-XDFP-F16
JESD-609 code e0 e0
low-bias YES YES
low-dissonance NO YES
Number of functions 2 2
Number of terminals 16 16
Maximum operating temperature 85 °C 125 °C
Minimum operating temperature -25 °C -55 °C
Package body material CERAMIC CERAMIC
encapsulated code DIP DFP
Encapsulate equivalent code DIP16,.3 FL16,.3
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK
Certification status Not Qualified Not Qualified
surface mount NO YES
technology HYBRID HYBRID
Temperature level OTHER MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT
Terminal pitch 2.54 mm 1.27 mm
Terminal location DUAL DUAL

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