IC,OP-AMP,DUAL,HYBRID,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| Reach Compliance Code | compliant |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | YES |
| Maximum input offset voltage | 1100 µV |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| low-bias | YES |
| low-dissonance | NO |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| LH2011BD | LH2011BF | |
|---|---|---|
| Description | IC,OP-AMP,DUAL,HYBRID,DIP,16PIN,CERAMIC | IC,OP-AMP,DUAL,HYBRID,FP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Reach Compliance Code | compliant | compliant |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | YES |
| Maximum input offset voltage | 1100 µV | 1100 µV |
| JESD-30 code | R-XDIP-T16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 |
| low-bias | YES | YES |
| low-dissonance | NO | NO |
| Number of functions | 2 | 2 |
| Number of terminals | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DFP |
| Encapsulate equivalent code | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | YES |
| technology | HYBRID | HYBRID |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
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