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74LS322FC

Description
Shift Register, 8-Bit, TTL, CDFP20,
Categorylogic    logic   
File Size117KB,4 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

74LS322FC Overview

Shift Register, 8-Bit, TTL, CDFP20,

74LS322FC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerFairchild
package instructionDFP, FL20,.3
Reach Compliance Codecompliant
JESD-30 codeR-XDFP-F20
JESD-609 codee0
Maximum Frequency@Nom-Sup35000000 Hz
Humidity sensitivity level2A
Number of digits8
Number of functions1
Number of terminals20
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL20,.3
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)250
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
This Material Copyrighted By Its Respective Manufacturer

74LS322FC Related Products

74LS322FC 74LS322PC 54LS322FM 74LS322DC
Description Shift Register, 8-Bit, TTL, CDFP20, Shift Register, 8-Bit, TTL, PDIP20, Shift Register, 8-Bit, TTL, CDFP20, Shift Register, 8-Bit, TTL, CDIP20,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Fairchild Fairchild Fairchild Fairchild
Reach Compliance Code compliant compliant compliant compliant
package instruction DFP, FL20,.3 - DFP, FL20,.3 DIP, DIP20,.3
JESD-30 code R-XDFP-F20 R-PDIP-T20 - R-XDIP-T20
JESD-609 code e0 e0 - e0
Maximum Frequency@Nom-Sup 35000000 Hz 35000000 Hz - 35000000 Hz
Humidity sensitivity level 2A 2A - 2A
Number of digits 8 8 - 8
Number of functions 1 1 - 1
Number of terminals 20 20 - 20
Maximum operating temperature 70 °C 70 °C - 70 °C
Package body material CERAMIC PLASTIC/EPOXY - CERAMIC
encapsulated code DFP DIP - DIP
Encapsulate equivalent code FL20,.3 DIP20,.3 - DIP20,.3
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form FLATPACK IN-LINE - IN-LINE
Peak Reflow Temperature (Celsius) 250 250 - 250
power supply 5 V 5 V - 5 V
Certification status Not Qualified Not Qualified - Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V - 5 V
surface mount YES NO - NO
technology TTL TTL - TTL
Temperature level COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE - THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm - 2.54 mm
Terminal location DUAL DUAL - DUAL
Maximum time at peak reflow temperature 30 30 - 30
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