CY7C123-10DMB datasheet, PDF - EEWORLD Datasheet

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CY7C123-10DMB: DescriptionStandard SRAM, 256X4, 10ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24; Categorystorage storage; File Size174KB，6 Pages; ManufacturerCypress Semiconductor

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CY7C123-10DMB Overview

Standard SRAM, 256X4, 10ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24

CY7C123-10DMB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	0.300 INCH, CERDIP-24
Contacts	24
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Maximum access time	10 ns
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.877 mm
memory density	1024 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	24
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X4
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.08 mm
Maximum standby current	0.15 A
Minimum standby current	4.5 V
Maximum slew rate	0.15 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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CY7C123-10DMB Related Products

	CY7C123-10DMB	CY7C123-7VC	CY7C123-15DMB	CY7C123-12PC
Description	Standard SRAM, 256X4, 10ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 256X4, 7ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 256X4, 15ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 256X4, 12ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOJ	DIP	DIP
package instruction	0.300 INCH, CERDIP-24	0.300 INCH, PLASTIC, SOJ-24	0.300 INCH, CERDIP-24	0.300 INCH, PLASTIC, DIP-24
Contacts	24	24	24	24
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	3A001.A.2.C	EAR99	3A001.A.2.C	EAR99
Maximum access time	10 ns	7 ns	15 ns	12 ns
JESD-30 code	R-GDIP-T24	R-PDSO-J24	R-GDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0
length	31.877 mm	15.367 mm	31.877 mm	31.623 mm
memory density	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	24	24	24	24
word count	256 words	256 words	256 words	256 words
character code	256	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	125 °C	70 °C
organize	256X4	256X4	256X4	256X4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	DIP	DIP
Encapsulate equivalent code	DIP24,.3	SOJ24,.34	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	3.556 mm	5.08 mm	4.826 mm
Maximum standby current	0.15 A	0.12 A	0.15 A	0.12 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.15 mA	0.12 mA	0.15 mA	0.12 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.5057 mm	7.62 mm	7.62 mm
Maker	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor

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