DTMF Signaling Circuit, CMOS, CDIP18, CERDIP-18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Zarlink Semiconductor (Microsemi) |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-GDIP-T18 |
| JESD-609 code | e0 |
| length | 22.99 mm |
| Number of functions | 1 |
| Number of terminals | 18 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 0.0055 mA |
| Nominal supply voltage | 3 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | DTMF SIGNALING CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
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