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KS128-33TG

Description
IC Socket, PGA128, 128 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder
CategoryThe connector    socket   
File Size261KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

KS128-33TG Overview

IC Socket, PGA128, 128 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

KS128-33TG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other features2.5 OZ. AVG. INSERTION FORCE
body width1.3 inch
subject depth0.165 inch
body length1.3 inch
Contact structure13X13
Contact to complete cooperationGOLD OVER NICKEL
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBERYLLIUM COPPER ALLOY
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA128
Shell materialPOLYIMIDE
JESD-609 codee0
Manufacturer's serial numberKS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts128
Maximum operating temperature400 °C
Minimum operating temperature-269 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
PGA Sockets
Table of Models
Low Insertion Force PGA Sockets
.100/(2.54mm) Standard Grid
Description:
Peel-A-Way
®
(KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description:
FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Features:
• Low insertion force (1 oz. average
per pin).
• Screw-machined terminals with
multiple finger contacts for
reliability.
• Closed bottom terminal for 100%
anti-wicking of solder.
• Tapered entry for ease of
insertion.
• Custom designs available.
Description:
Molded (RIS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
RIS replaces HCIS, HCS, CIS, and CS.
?
?
.005
(.13)
PC Board
PC Board
Polyimide
Film
.062
(1.57)
.095
(2.41)
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
1 RIS
Footprint Dash #
If Applicable
*
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
®
068 - 04 M G
Contact Plating
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
FIS - FR-4
RIS - Hi-Temp Molded LCP
Number of Pins
004 to 484
*Footprints available online
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
1 ESX 503 - 234
Footprint Dash #
Body Type
M
G
RoHS Compliant:
Contact Plating
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
If Applicable
*
inch/(mm)
G - Gold
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