NT
SinglFuse
™
SF-0402F Series Features
■
Single blow fuse for overcurrent
■
■
■
■
■
Thin film chip fuse
■
Surface mount packaging for automated
M
PL
IA
protection
1005 (EIA 0402) miniature footprint
Fast-acting fuse
UL certified
RoHS compliant* and
halogen free
S
CO
*R
assembly
oH
SF-0402F Series - Fast Acting Surface Mount Fuses
Electrical Characteristics
Rated Current
Resistance
Fusing Time
(Amps)
(mΩ) Typ.*
SF-0402F050
0.50
320
SF-0402F075
0.75
110
SF-0402F080
0.80
120
SF-0402F100
1.00
90
SF-0402F125
1.25
67
Open within 1
SF-0402F150
1.50
51
min. at 200 %
SF-0402F160
1.60
46
rated current
SF-0402F200
2.00
33
SF-0402F250
2.50
25
SF-0402F300
3.00
20
SF-0402F315
3.15
19
SF-0402F400
4.00
16
*Resistance value was measured with less than 10 % of rated current.
Model
Reliability Testing
Rated
Voltage
Breaking
Capacity
DC 24 V
DC24 V 35 A
Typical
I
2
t (A
2
s)
0.00317
0.0049
0.00532
0.00724
0.01344
0.01356
0.01672
0.01983
0.03763
0.05427
0.06304
0.0896
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability .................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat........................ ±20 % ........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % ........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent............................... No evident damage on protective .............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance ................................. 10k W or more ...........................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SF - 0402 F 050 - 2
SinglFuse™
Product Designator
SMD Footprint
1005 (EIA 0402) size
RATING CURRENT (A)
F = 0.50
N = 1.60
• = 0.75
S = 2.00
K = 0.80
T = 2.50
L = 1.00
3 = 3.00
M = 1.25
U = 3.15
P = 1.50
W = 4.00
Fuse Blow Type
F = Fast acting
S = Slow blow
Rated Current
050-400 (500 mA - 4.00 A)
Packaging Type
- 2 = Tape & Reel (10,000 pcs./reel)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
SinglFuse
™
SF-0402F Series Applications
■
Portable memory
■
LCD monitors
■
Disk drives
■
PDAs
■
Digital cameras
■
DVDs
■
Cell phones
■
Rechargeable battery packs
■
Battery chargers
■
Set top boxes
■
Industrial controllers
SF-0402F Series - Fast Acting Surface Mount Fuses
Solder Reflow Recommendations
250
Peak: 250 +0/-5 °C
230 °C or higher
TEMPERATURE (°C)
200
180 °C
150
150 °C
PRE-HEATING ZONE
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
Product Dimensions
1.0 ± 0.1
(.039 ± .004)
0.35 ± 0.05
(.014 ± .002)
0.52 ± 0.05
(.020 ± .002)
0.25 ± 0.1
(.010 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.25 ± 0.1
(.010 ± .004)
Recommended Pad Layout
0.381
(.015)
0.558
(.022)
DIMENSIONS:
PACKAGING: 10,000 pcs./reel
MM
(INCHES)
1.55
(.061)
Thermal Derating Curve
120
Construction & Material Content
OVERCOAT
PERCENT OF RATING (%)
110
100
Sn PLATING
FUSE ELEMENT
Cu / Ni PLATING
90
CERAMIC SUBSTRATE
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
Embedded System
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