BAS16 / MMBD4148 / MMBD914
SURFACE MOUNT SWITCHING DIODE
Features
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Fast Switching Speed
Surface Mount Package Ideally Suited for Automated Insertion
For General Purpose Switching Applications
High Conductance
Qualified to AEC-Q101 Standards for High Reliability
Lead, Halogen and Antimony Free, RoHS Compliant
"Green' Device (Notes 3 and 4)
Mechanical Data
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•
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SOT-23
Case: SOT-23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.008 grams (approximate)
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Symbol
V
RM
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
O
@ t = 1.0μs
@ t = 1.0s
I
FSM
Value
100
75
53
300
200
2.0
1.0
Unit
V
V
V
mA
mA
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
T
J
, T
STG
Value
350
357
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)R
V
F
Min
75
⎯
Max
⎯
0.715
0.855
1.0
1.25
1.0
50
30
25
2.0
4.0
Unit
V
V
μA
μA
μA
nA
pF
ns
Test Condition
I
R
= 100μA
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
V
R
= 75V
V
R
= 75V, T
J
= 150°C
V
R
= 25V, T
J
= 150°C
V
R
= 20V
V
R
= 0, f = 1.0MHz
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100Ω
Leakage Current (Note 2)
Total Capacitance
Reverse Recovery Time
Notes:
1.
2.
3.
4.
I
R
C
T
t
rr
⎯
⎯
⎯
Device mounted on glass epoxy PCB 1.6” x 1.6” x 0.06”; mounting pad for the cathode lead min. 0.93in
2
.
Short duration pulse test used to minimize self-heating effect.
No purposefully added lead. Halogen and Antimony Free.
Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured
prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
BAS16 / MMBD4148 / MMBD914
Document number: DS12003 Rev. 22 - 2
1 of 4
www.diodes.com
July 2009
© Diodes Incorporated
BAS16 / MMBD4148 / MMBD914
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
500
1
P
D
, POWER DISSIPATION (mW)
400
0.1
300
200
0.01
100
0
0
0.001
0
0.5
1.0
1.5
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
100
200
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
I
R
, INSTANTANEOUS REVERSE CURRENT (nA)
10,000
2.0
1.8
C
T
, TOTAL CAPACITANCE (pF)
1,000
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
100
10
1
0.1
0
60
80
100
20
40
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
0.0
0
10
30
40
20
V
R
, DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
Ordering Information
Part Number
BAS16-7-F
MMBD4148-7-F
MMBD914-7-F
Notes:
(Note 5)
Case
SOT-23
SOT-23
SOT-23
Packaging
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KA2 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
KA2
Date Code Key
Year
Code
Month
Code
1998
J
Jan
1
1999
K
Feb
2
2000
L
2001
M
Mar
3
2002
N
Apr
4
2003
P
May
5
YM
2004
R
Jun
6
2005
S
2006
T
Jul
7
2007
U
Aug
8
2008
V
Sep
9
2009
W
Oct
O
2010
X
2011
Y
Nov
N
2012
Z
Dec
D
July 2009
BAS16 / MMBD4148 / MMBD914
Document number: DS12003 Rev. 22 - 2
2 of 4
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© Diodes Incorporated
BAS16 / MMBD4148 / MMBD914
Package Outline Dimensions
A
B C
H
K
D
J
F
G
L
M
K1
SOT-23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
-
-
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°
-
α
All Dimensions in mm
Suggested Pad Layout
Y
Z
C
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
X
E
BAS16 / MMBD4148 / MMBD914
Document number: DS12003 Rev. 22 - 2
3 of 4
www.diodes.com
July 2009
© Diodes Incorporated
BAS16 / MMBD4148 / MMBD914
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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Copyright © 2009, Diodes Incorporated
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BAS16 / MMBD4148 / MMBD914
Document number: DS12003 Rev. 22 - 2
4 of 4
www.diodes.com
July 2009
© Diodes Incorporated
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