Green
B520C - B560C
5.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
•
•
•
•
•
•
Guard Ring Die Construction for Transient Protection
Ideally Suited for Automated Assembly
Low Power Loss, High Efficiency
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Application
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
Mechanical Data
•
•
•
•
•
•
Case: SMC
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Weight: 0.21 grams (approximate)
Top View
Bottom View
Ordering Information
(Note 3)
Part Number
B5xxC-13-F
* xx = Device type, e.g. B520C-13-F (SMC package).
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Case
SMC
Packaging
3000/Tape & Reel
Marking Information
YWW
B5x0C
B5x0C = Product type marking code, ex: B540C (SMC package)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
WW = Week code (01 to 53)
x = 2,3,4,5 or 6 - i.e., x = 4 for B540C
B520C - B560C
Document number: DS13012 Rev. 14 - 2
1 of 4
www.diodes.com
September 2010
© Diodes Incorporated
B520C - B560C
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 90°C
Non-Repetitive Peak Forward Surge Current, 8.3 ms
Single Half-Sine-Wave Superimposed on Rated Load
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
B520C
20
14
B530C
30
21
B540C
40
28
5.0
100
B550C
50
35
B560C
60
42
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Terminal
Thermal Resistance, Junction to Ambient (Note 4)
Operating Temperature Range
Storage Temperature Range
Symbol
R
θ
JT
R
θ
JA
T
J
T
STG
Value
10
50
-55 to +125
-55 to +150
Unit
°C/W
°C/W
°C
°C
Electrical Characteristics
Characteristic
Forward Voltage Drop
Leakage Current (Note 5)
Total Capacitance
Notes:
@T
A
= 25°C unless otherwise specified
Symbol
B520C, B530C, B540C
B550C, B560C
V
F
I
R
C
T
2
Min
-
-
Typ
-
-
-
-
-
-
-
-
Max
0.55
0.70
0.5
20
300
Unit
V
mA
pF
Test Condition
I
F
= 5.0A, T
A
= 25°C
@ Rated V
R
, T
A
= 25°C
@ Rated V
R
, T
A
= 100°C
V
R
= 4V, f = 1MHz
4. Thermal Resistance: Junction to ambient, unit mounted on PC board with 8.0 mm (0.033 mm thick) copper pads as heat sink.
5. Short duration pulse test used to minimize self-heating effect.
I
R
, INSTANTANEOUS REVERSE CURRENT (mA)
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
100
100
T
j
= 125°C
10
10
B520C - B540C
T
j
= 100°C
1.0
B550C - B560C
0.1
1.0
0.01
T
j
= 25°C
T
j
= 25ºC
I
F
Pulse Width = 300 ms
0.1
0
0.2
0.4
0.6
0.8
1.0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Typical Forward Characteristics
0.001
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 2 Typical Reverse Characteristics
B520C - B560C
Document number: DS13012 Rev. 14 - 2
2 of 4
www.diodes.com
September 2010
© Diodes Incorporated
B520C - B560C
1,000
I
F(AV),
AVERAGE FORWARD CURRENT (A)
5.0
C
T
, TOTAL CAPACITANCE (pF)
4.0
3.0
100
2.0
1.0
10
0.1
1
10
100
V
R
, DC REVERSE VOLTAGE (V)
Fig. 3 Total Capacitance vs. Reverse Voltage
0
25
50
75
100
125
T
T
, TERMINAL TEMPERATURE (ºC)
Fig. 4 Forward Current Derating Curve
150
175
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
Single Half-Sine-Wave
140
105
70
35
10
100
NUMBER OF CYCLES AT 60 Hz
Fig. 5 Max Non-Repetitive Peak Forward Surge Current
0
1
Package Outline Dimensions
B
A
C
D
J
SMC
Dim
Min
Max
A
5.59
6.22
B
6.60
7.11
C
2.75
3.18
D
0.15
0.31
E
7.75
8.13
G
0.10
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
H
G
E
B520C - B560C
Document number: DS13012 Rev. 14 - 2
3 of 4
www.diodes.com
September 2010
© Diodes Incorporated
B520C - B560C
Suggested Pad Layout
Dimensions Value (in mm)
Z
9.3
G
4.4
X
3.3
Y
2.5
C
6.8
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
B520C - B560C
Document number: DS13012 Rev. 14 - 2
4 of 4
www.diodes.com
September 2010
© Diodes Incorporated
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