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MMSZ5245B

Description
15 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
Categorysemiconductor    Discrete semiconductor   
File Size77KB,5 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
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MMSZ5245B Overview

15 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE

MMSZ5245B Parametric

Parameter NameAttribute value
Number of terminals2
Number of components1
Rated working voltage15 V
Processing package descriptionPLASTIC PACKAGE-2
stateTRANSFERRED
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
terminal coatingNOT SPECIFIED
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
CraftsmanshipZENER
structuresingle
Diode component materialssilicon
Maximum power consumption limit0.5000 W
polarityunidirectional
Diode typeZener diode
Working test current8.5 mA
Maximum total reference voltage5 %
MMSZ5221B - MMSZ5259B
500mW SURFACE MOUNT ZENER DIODE
Features
500mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant (Note 3)
"Green" Device (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOD-123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Ordering Information: See Page 3
Marking Information: See Page 3
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings
Forward Voltage
@T
A
= 25°C unless otherwise specified
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Characteristic
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @T
L
= 75°C
Thermal Resistance, Junction to Ambient Air (Note 1)
Thermal Resistance, Junction to Lead (Note 2)
Operating and Storage Temperature Range
Notes:
1.
2.
3.
4.
Symbol
P
D
R
θ
JA
R
θ
JL
T
J,
T
STG
Value
500
350
150
-65 to +150
Unit
mW
°C/W
°C/W
°C
Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.
Thermal Resistance measurement obtained via infrared scan method.
No purposefully added lead. Halogen and Antimony Free.
Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
1 of 5
www.diodes.com
May 2009
© Diodes Incorporated

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