Green
S1A/B - S1M/B
1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
•
•
•
•
•
Glass Passivated Die Construction for High Reliability
Surge Overload Rating to 30A Peak
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
Mechanical Data
•
•
•
•
•
•
Case: SMA/SMB
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Weight: SMA - 0.064 grams (approximate)
SMB - 0.093 grams (approximate)
Top View
Bottom View
Ordering Information
(Note 3)
Part Number
S1x-13-F
S1xB-13-F
* x = Device type, e.g. S1A-13-F (SMA package); S1AB-13-F (SMB package)
.
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Case
SMA
SMB
Packaging
5000/Tape & Reel
3000/Tape & Reel
Marking Information
YWW
xxx(x)
XXX = Product type marking code, ex: S1A (SMA package)
XXXX = Product type marking code, ex: S1AB (SMB package)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
WW = Week code (01 to 53)
S1A/B - S1M/B
Document number: DS16003 Rev. 20 - 2
1 of 4
www.diodes.com
September 2010
© Diodes Incorporated
S1A/B - S1M/B
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 100°C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on rated load
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
S1
A/AB
50
35
S1
B/BB
100
70
S1
D/DB
200
140
S1
G/GB
400
280
1.0
30
S1
J/JB
600
420
S1
K/KB
800
560
S1
M/MB
1000
700
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Typical Thermal Resistance, Junction to Terminal (Note 4)
Operating and Storage Temperature Range
Symbol
R
θ
JT
T
J,
T
STG
Value
30
-65 to +150
Unit
°C/W
°C
Electrical Characteristics
Characteristic
Forward Voltage
Peak Reverse Leakage Current
at Rated DC Blocking Voltage
Reverse Recovery Time (Note 5)
Typical Total Capacitance
(Note 6)
Notes:
@T
A
= 25°C unless otherwise specified
Symbol
V
FM
I
RM
t
rr
C
T
Min
-
-
-
-
-
Typ
-
-
-
1.8
10
Max
1.1
5.0
100
3.0
-
Unit
V
μA
μs
pF
@ I
F
= 1.0A
@ T
A
= 25°C
@ T
A
= 125°C
4. Thermal resistance junction to terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pads as heat sink.
5. Measured with I
F
= 0.5A, I
R
= 1.0A, I
RR
= 0.25A.
6. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
0.8
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
180
1.0
I
F
, AVERAGE FORWARD CURRENT (A)
10
1.0
0.6
0.4
0.1
0.2
Resistive or
inductive load
0
40
60
80 100
120
140
160
T
T
, TERMINAL TEMPERATURE (
°
C)
Fig. 1 Forward Current Derating Curve
0.01
0
0.4
0.8
1.2
1.6
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
S1A/B - S1M/B
Document number: DS16003 Rev. 20 - 2
2 of 4
www.diodes.com
September 2010
© Diodes Incorporated
S1A/B - S1M/B
I
R
, INSTANTANEOUS REVERSE CURRENT (µA)
30
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
8.3ms Single half sine-wave
1,000
25
100
T
J
= 125
°
C
20
10
15
1.0
T
J
= 25
°
C
10
0.1
5
1
10
NUMBER OF CYCLES @ 60Hz
Fig. 3 Typical Forward Characteristics
100
0.01
0
40
120
80
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 4 Typical Reverse Characteristics
Package Outline Dimensions
B
A
C
D
J
SMA
Dim
Min
Max
A
2.29
2.92
B
4.00
4.60
C
1.27
1.63
D
0.15
0.31
E
4.80
5.59
G
0.05
0.20
H
0.76
1.52
J
2.01
2.30
All Dimensions in mm
SMB
Dim
Min
Max
A
3.30
3.94
B
4.06
4.57
C
1.96
2.21
D
0.15
0.31
E
5.00
5.59
G
0.05
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
H
E
G
Suggested Pad Layout
C
X
Y
G
Z
SMA
Value (in mm)
Dimensions
Z
6.5
G
1.5
X
1.7
Y
2.5
C
4.0
SMB
Value (in mm)
Dimensions
Z
6.7
G
1.8
X
2.3
Y
2.5
C
4.3
S1A/B - S1M/B
Document number: DS16003 Rev. 20 - 2
3 of 4
www.diodes.com
September 2010
© Diodes Incorporated
S1A/B - S1M/B
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
S1A/B - S1M/B
Document number: DS16003 Rev. 20 - 2
4 of 4
www.diodes.com
September 2010
© Diodes Incorporated
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