FIFO, 64X9, 6.5ns, Synchronous, CMOS, PQCC32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 6.5 ns |
| Maximum clock frequency (fCLK) | 100 MHz |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of terminals | 32 |
| word count | 64 words |
| character code | 64 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64X9 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.005 A |
| Maximum slew rate | 0.05 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 20 |
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