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IS25C32B-3ZLA3-TR

Description
Memory IC, 4KX8, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153AA, TSSOP-8
Categorystorage    storage   
File Size562KB,15 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS25C32B-3ZLA3-TR Overview

Memory IC, 4KX8, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153AA, TSSOP-8

IS25C32B-3ZLA3-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSSOP
package instructionTSSOP,
Contacts8
Reach Compliance Codecompliant
Maximum clock frequency (fCLK)10 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
memory density32768 bit
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count4096 words
character code4000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize4KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)5 ms
IS25C32B
32K-BIT SPI AUTOMOTIVE EEPROM
Advanced Information
SEPTEMBER 2009
FEATURES
• Serial Peripheral Interface (SPI) Compatible
— Supports SPI Modes 0 (0,0) and 3 (1,1)
• Wide Voltage Operation
— Vcc = 2.7V to 3.6V
• Low power CMOS
— Active current: 4 mA (max)
— Standby current: 5 µA (max)
• Block Write Protection
— Protect 1/4, 1/2, or Entire Array
• 32 byte page write mode
— Partial page writes allowed
• 10 MHz Clock Rate (3.6V)
• Self timed write cycles
— 5 ms max @ 2.7V
• High-reliability
— Endurance: 1 million cycles
— Data retention: 100 years
• Temperature: -40
o
C to 125
o
C
• Packages (8-pin): SOIC/SOP and TSSOP
DESCRIPTION
The IS25C32B is an electrically erasable PROM device
that uses the Serial Peripheral Interface (SPI) for
communications. The IS25C32B is 32Kbit (4096 x 8). It
is offered in a wide operating voltage range of 2.7V to
3.6V to be compatible with most application voltages.
ISSI designed the IS25C32B to be an efficient SPI
EEPROM solution. The devices are packaged in 8-pin
SOIC (JEDEC) and 8-pin TSSOP.
The functional features of the IS25C32B allows them to
be among the most advanced serial non-volatile memo-
ries available. Each device has a Chip-Select (CS) pin,
and a 3-wire interface of Serial Data In (SI), Serial Data
Out (SO), and Serial Clock (SCK). While the 3-wire
interface of the IS25C32B provides for high-speed ac-
cess, a
HOLD
pin allows the memories to ignore the
interface in a suspended state; later the
HOLD
pin re-
activates communication without re-initializing the serial
sequence. A Status Register facilitates a flexible write
protection mechanism, and a device-ready bit (RDY).
Copyright © 2008 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for critical medical or surgical
equipment, aerospace systems, or for other applications planned to support or sustain life. It is the customer's obligation to optimize the design in their own products for
the best performance and optimization on the functionality and etc. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and prior placing orders for
products.
Advanced Information Rev. 00B
08/27/09
Integrated Silicon Solution, Inc. — www.issi.com
1

IS25C32B-3ZLA3-TR Related Products

IS25C32B-3ZLA3-TR IS25C32B-3GLA3-TR
Description Memory IC, 4KX8, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153AA, TSSOP-8 Memory IC, 4KX8, CMOS, PDSO8, 0.150 INCH, LEAD FREE, SOIC-8
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Parts packaging code TSSOP SOIC
package instruction TSSOP, SOP,
Contacts 8 8
Reach Compliance Code compliant compliant
Maximum clock frequency (fCLK) 10 MHz 10 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e3
length 4.4 mm 4.9 mm
memory density 32768 bit 32768 bit
memory width 8 8
Humidity sensitivity level 1 3
Number of functions 1 1
Number of terminals 8 8
word count 4096 words 4096 words
character code 4000 4000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
organize 4KX8 4KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.75 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 40 40
width 3 mm 3.9 mm
Maximum write cycle time (tWC) 5 ms 5 ms
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