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GM23C8000A-12

Description
MASK ROM, 1MX8, 120ns, CMOS, PDIP32, DIP-32
Categorystorage    storage   
File Size284KB,5 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

GM23C8000A-12 Overview

MASK ROM, 1MX8, 120ns, CMOS, PDIP32, DIP-32

GM23C8000A-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
package instructionDIP, DIP32,.6
Reach Compliance Codecompliant
Maximum access time120 ns
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length42.0375 mm
memory density8388608 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height4.826 mm
Maximum standby current0.00005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

GM23C8000A-12 Related Products

GM23C8000A-12 GM23C8000AFW-12 GM23C8000A-15 GM23C8000AFW-15
Description MASK ROM, 1MX8, 120ns, CMOS, PDIP32, DIP-32 MASK ROM, 1MX8, 120ns, CMOS, PDSO32, SOP-32 MASK ROM, 1MX8, 150ns, CMOS, PDIP32, DIP-32 MASK ROM, 1MX8, 150ns, CMOS, PDSO32, SOP-32
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker SK Hynix SK Hynix SK Hynix SK Hynix
package instruction DIP, DIP32,.6 SOP, SOP32,.56 DIP, DIP32,.6 SOP, SOP32,.56
Reach Compliance Code compliant compliant compliant compliant
Maximum access time 120 ns 120 ns 150 ns 150 ns
JESD-30 code R-PDIP-T32 R-PDSO-G32 R-PDIP-T32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0
length 42.0375 mm 20.498 mm 42.0375 mm 20.498 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 32 32 32 32
word count 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 1MX8 1MX8 1MX8 1MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP SOP
Encapsulate equivalent code DIP32,.6 SOP32,.56 DIP32,.6 SOP32,.56
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.826 mm 3.2 mm 4.826 mm 3.2 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO YES NO YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
width 15.24 mm 11.2015 mm 15.24 mm 11.2015 mm
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