Loadable PLD, CMOS, PPGA391,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | I-Cube Inc |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PPGA-P391 |
| JESD-609 code | e0 |
| Number of terminals | 391 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | PGA |
| Encapsulate equivalent code | SPGA391,35X35 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3/5,5 V |
| Programmable logic type | LOADABLE PLD |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 1.27 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| IQX320-10PP391I | IQX320-10PP391 | IQX320-12PP391I | IQX320-12PP391 | IQX320-15PP391I | IQX320-15PP391 | IQX320-7PP391 | |
|---|---|---|---|---|---|---|---|
| Description | Loadable PLD, CMOS, PPGA391, | Loadable PLD, CMOS, PPGA391, | Loadable PLD, CMOS, PPGA391, | Loadable PLD, CMOS, PPGA391, | Loadable PLD, CMOS, PPGA391, | Loadable PLD, CMOS, PPGA391, | Loadable PLD, CMOS, PPGA391, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | I-Cube Inc | I-Cube Inc | I-Cube Inc | I-Cube Inc | I-Cube Inc | I-Cube Inc | I-Cube Inc |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-PPGA-P391 | S-PPGA-P391 | S-PPGA-P391 | S-PPGA-P391 | S-PPGA-P391 | S-PPGA-P391 | S-PPGA-P391 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 391 | 391 | 391 | 391 | 391 | 391 | 391 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| Encapsulate equivalent code | SPGA391,35X35 | SPGA391,35X35 | SPGA391,35X35 | SPGA391,35X35 | SPGA391,35X35 | SPGA391,35X35 | SPGA391,35X35 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3/5,5 V | 3/5,5 V | 3/5,5 V | 3/5,5 V | 3/5,5 V | 3/5,5 V | 3/5,5 V |
| Programmable logic type | LOADABLE PLD | LOADABLE PLD | LOADABLE PLD | LOADABLE PLD | LOADABLE PLD | LOADABLE PLD | LOADABLE PLD |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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