TMS320C6203BGLSA300 datasheet, PDF

TMS320C6203BGLSA300: Description32-BIT, 300MHz, OTHER DSP, PBGA384, PLASTIC, BGA-384; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，90 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS320C6203BGLSA300 Overview

32-BIT, 300MHz, OTHER DSP, PBGA384, PLASTIC, BGA-384

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	HFBGA, BGA384,22X22,32
Contacts	384
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	22
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	300 MHz
External data bus width	32
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B384
length	18 mm
low power mode	YES
Number of terminals	384
Maximum operating temperature	90 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	HFBGA
Encapsulate equivalent code	BGA384,22X22,32
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
power supply	1.5,3.3 V
Certification status	Not Qualified
RAM (number of words)	524288
Maximum seat height	2.8 mm
Maximum supply voltage	1.75 V
Minimum supply voltage	1.65 V
Nominal supply voltage	1.7 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	18 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER

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