Tentative
DA2DF62
Silicon epitaxial planar type
For high frequency rectification
Marking Symbol : DA2DF62
Package Code : TO-220D-B1
Absolute Maximum Ratings Ta = 25 °C
Parameter
Repetitive peak reverse voltage
Non-repetitive peak peak reverse voltage
Forward current
Ta = 25 °C
Non-repetitive peak forward surge current
Junction temperature
Storage temperature
DA2DF62
Total pages
page
Symbol
VRRM
VRSM
IF(AV)
IFSM
Tj
Tstg
Rating
600
600
10
40
150
-40 to +150
Unit
V
V
A
A
°C
°C
*
Note: 1. *1 50 Hz sine wave 1cycle(Non-repetitive peak current)
Electrical Characteristics Ta = 25 °C±3 °C
Parameter
Forward voltage
Reverse current
Reverse recovery time
Themal resistance
Themal resistance
*1
Symbol
VF
IRRM
trr
Rth(j-c)
Rth(j-a)
Conditions
IF = 10 A
VRRM = 600 V
IF = 0.5 A, VR = 1.0 A
Irr = 0.25 A
Min
Typ
1.4
25
Max
1.7
10
40
4.0
63
Unit
V
μA
ns
°C / W
°C / W
Note: 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring
methods for Diodes.
2. Absolute frequency of input and outpot is 10 MHz
3. *1 R-load trr test circuit
Packing
Magagine 50 pcs
2009.10.28
2010.8.31
Prepared
Revised
Semiconductor Company, Panasonic Corporation
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
regulations of the exporting country, especially, those with regar
(2) The technical information described in this book is intended onl
of the products. No license is granted in and to any intellectual p
other company. Therefore, no responsibility is assumed by our
other company which may arise as a result of the use of technica
(3) The products described in this book are intended to be used fo
equipment, measuring instruments and household appliances), o
Consult our sales staff in advance for information on the followi
–
Special applications (such as for airplanes, aerospace, automo
life support systems and safety devices) in which exceptional q
the products may directly jeopardize life or harm the human bo
It is to be understood that our company shall not be held respo
your using the products described in this book for any special a
this book for any special application.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values,
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
damp-proof packing is required, satisfy the conditions, such as s
(7) This book may be not reprinted or reproduced whether wholly or
20100202