Tentative
DA26101
Silicon epitaxial planar type
For high speed switching circuits
Marking Symbol : A1
Package Code : ML2-N3-B
Absolute Maximum Ratings Ta = 25 °C
Parameter
Reverse voltage
Maximum peak reverse voltage
Forward current
Peak forward current
Non-repetitive peak forward surge current
*1
Junction temperature
Storage temperature
Note: 1. *1
t = 1 s
DA26101
Total pages
page
Symbol
VR
VRM
IF
IFM
IFSM
Tj
Tstg
Rating
80
80
100
225
500
125
-55 to +125
Unit
V
V
mA
mA
mA
°C
°C
Pin name
1.
Cathode
2.
Anode
Electrical Characteristics Ta = 25 °C±3 °C
Parameter
Forward voltage
Reverse voltage
Reverse current
Terminal capacitance
Reverse recovery time
*1
Symbol
VF
VR
IR
Ct
trr
Conditions
IF = 100 mA
IR = 100
μA
VR = 80 V
VR = 0 V , f = 1 MHz
IF = 10 mA, VR = 6 V
Irr = 0.25 x IR
Min
80
Typ
0.92
Max
1.20
100
1.2
3
Unit
V
V
nA
pF
ns
Note: 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring
methods for Diodes.
2. Absolute frequency of input and output is 100 MHz.
3. *1 trr test circuit
Irr = 0.25 × IR
IF = 10 mA
VR = 6 V
Packing
Embossed type (Thermo-compression sealing) : 10 000 pcs / reel
2010.4.7
2010.7.27
Prepared
Revised
Semiconductor Company, Panasonic Corporation
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
regulations of the exporting country, especially, those with regar
(2) The technical information described in this book is intended onl
of the products. No license is granted in and to any intellectual p
other company. Therefore, no responsibility is assumed by our
other company which may arise as a result of the use of technica
(3) The products described in this book are intended to be used fo
equipment, measuring instruments and household appliances), o
Consult our sales staff in advance for information on the followi
–
Special applications (such as for airplanes, aerospace, automo
life support systems and safety devices) in which exceptional q
the products may directly jeopardize life or harm the human bo
It is to be understood that our company shall not be held respo
your using the products described in this book for any special a
this book for any special application.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values,
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
damp-proof packing is required, satisfy the conditions, such as s
(7) This book may be not reprinted or reproduced whether wholly or
20100202