Tentative
DB24404
Silicon epitaxial planar type
For rectification
Marking Symbol : A8
Package Code : TMiniP2-F2-B
Absolute Maximum Ratings Ta = 25 °C
Parameter
Reverse voltage
Maximum peak reverse voltage
Forward current (Average)
*1
Non-repetitive peak forward surge current
Junction temperature
Storage temperature
DB24404
Total pages
page
Symbol
VR
VRM
IF（AV）
IFSM
Tj
Tstg
Rating
40
40
3.0
60
125
-40 to +125
Unit
V
V
A
A
°C
°C
Pin name
1.
Cathode
2.
Anode
Note: 1. *1 50Hz sine wave 1 cycle (Non-repetitive peak current)
Electrical Characteristics Ta = 25 °C±3 °C
Parameter
Forward voltage
Reverse current
Terminal capacitance
Reverse recovery time
*1
Symbol
VF
IR
Ct
trr
Conditions
IF = 3.0 A
VR = 40 V
VR = 10 V, f = 1 MHz
IF = IR = 100 mA
Irr = 10 mA, RL = 100
Ω
Min
Typ
85
30
Max
0.53
50
Unit
V
μA
pF
ns
Note: 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031
measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the
charge of a human body and the leakage of current from the operating equipment.
3. *1 trr Test Circuit
Bias Insertion Unit
(N-50BU)
Input Pulse
Output Pulse
I
rr
= 10 mA
Pulse Generator
(PG-10N)
R
S
= 50
Ω
Wave Form Analyzer
(SAS-8130)
R
i
= 50
Ω
I
F
= 100 mA
I
R
= 100 mA
R
L
= 100
Ω
Packing
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel
2010.4.23
2010.7.27
Prepared
Revised
Semiconductor Company, Panasonic Corporation
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
regulations of the exporting country, especially, those with regar
(2) The technical information described in this book is intended onl
of the products. No license is granted in and to any intellectual p
other company. Therefore, no responsibility is assumed by our
other company which may arise as a result of the use of technica
(3) The products described in this book are intended to be used fo
equipment, measuring instruments and household appliances), o
Consult our sales staff in advance for information on the followi
–
Special applications (such as for airplanes, aerospace, automo
life support systems and safety devices) in which exceptional q
the products may directly jeopardize life or harm the human bo
It is to be understood that our company shall not be held respo
your using the products described in this book for any special a
this book for any special application.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values,
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
damp-proof packing is required, satisfy the conditions, such as s
(7) This book may be not reprinted or reproduced whether wholly or
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Analog electronics
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