This product complies with the RoHS Directive (EU 2002/95/EC).
DE2S068
Silicon epitaxial planar type
For ESD protection
Features
High electrostatic discharge ESD
Contributes to miniaturization of sets, reduction of component count.
Eco-friendly Halogen-free package
Package
Code
SSMini2-F5-B
Name
Pin
1. Cathode
2. Anode
Packaging
Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard)
Marking Symbol: E2
Unit
mW
kV
°C
°C
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Total power dissipation
*1
Electrostatic discharge
*2
Junction temperature
Storage temperature
Symbol
P
T
ESD
T
j
T
stg
Rating
150
±30
150
–55 to +150
Note) *1: P
T
= 150 mW achieved with a printed circuit board.
*2: Test method: IEC61000-4-2 (C = 150 pF, R = 330
W,
Contact discharge: 10 times)
Electrical Characteristics
T
a
= 25°C±3°C
Parameter
Zener voltage
*1, 2
Reverse current
Terminal capacitance
Temperature coefficient of zener voltage
*3
Symbol
V
Z
I
R
C
t
S
Z
I
R
= 1 mA
V
R
= 4 V
V
R
= 0 V, f = 1 MHz
I
Z
= 1 mA
50
3.0
Conditions
Min
6.46
Typ
Max
7.14
0.5
Unit
V
mA
pF
mV/°C
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. *1: The temperature must be controlled 25°C for V
Z
measurement. V
Z
value measured at other temperature must be adjusted to V
Z
(25°C)
*2 : V
Z
guaranteed 20 ms after current flow.
*3 : T
j
= 25°C to 150°C
Publication date: October 2010
Ver. BED
1
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
regulations of the exporting country, especially, those with regar
(2) The technical information described in this book is intended onl
of the products. No license is granted in and to any intellectual p
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(3) The products described in this book are intended to be used fo
equipment, measuring instruments and household appliances), o
Consult our sales staff in advance for information on the followi
–
Special applications (such as for airplanes, aerospace, automo
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the products may directly jeopardize life or harm the human bo
It is to be understood that our company shall not be held respo
your using the products described in this book for any special a
this book for any special application.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values,
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
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