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DFLS130L_09

Description
DIODES INC. - DFLS130L-7 - SCHOTTKY DIODE; 1A; 30V; PowerDI-123
Categorysemiconductor    Discrete semiconductor   
File Size79KB,4 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
Download Datasheet View All

DFLS130L_09 Overview

DIODES INC. - DFLS130L-7 - SCHOTTKY DIODE; 1A; 30V; PowerDI-123

DFLS130L
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
®
123
Please click here to visit our online spice models database.
Features
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
Patented Interlocking Clip Design for High Surge Current
Capacity
High Current Capability and Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 4)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: PowerDI 123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.01 grams (approximate)
®
Top View
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current @ T
T
= 121°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
F(AV)
I
FSM
Value
30
21
1.0
50
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range
Storage Temperature Range
Symbol
P
D
P
D
R
θ
JA
R
θ
JA
R
θ
JS
T
J
T
STG
Value
1.67
556
60
180
10
-40 to +125
-40 to +150
Unit
W
mW
°C/W
°C/W
°C/W
°C
°C
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Leakage Current (Note 5)
Total Capacitance
Notes:
1.
2.
3.
4.
5.
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)R
V
F
I
R
C
T
Min
30
Typ
0.210
0.310
0.328
0.260
76
Max
0.36
1.0
Unit
V
V
mA
pF
Test Condition
I
R
= 1.0mA
I
F
= 0.1A
I
F
= 1.0A
I
F
= 1.5A
V
R
= 5V, T
A
= 25°C
V
R
= 30V, T
A
= 25°C
V
R
= 10V, f = 1.0MHz
Part mounted on 2"x2" GETEK board with 1"x1" copper pad, 25% anode, 75% cathode. T
A
= 25°C.
Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Theoretical R
θJS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/products/lead_free.html.
Short duration pulse test used to minimize self-heating effect.
PowerDI is a registered trademark of Diodes Incorporated.
1 of 4
DFLS130L
Document number: DS30492 Rev. 4 - 2
June 2009
© Diodes Incorporated
www.diodes.com
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