This product complies with the RoHS Directive (EU 2002/95/EC).
DA2J101
Silicon epitaxial planar type
For high speed switching circuits
Features
Package
Code
SMini2-F5-B
Name
Pin
1: Cathode
2: Anode
Small reverse current I
R
Short reverse recovery time t
rr
Contributes to miniaturization of sets, reduction of component count.
Eco-friendly Halogen-free package
Packaging
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
Marking Symbol: A1
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Reverse voltage
Maximum peak reverse voltage
Forward current
Peak forward current
Non-repetitive peak forward surge current
*
Junction temperature
Storage temperature
Note) *: 1 t = 1 s
Symbol
V
R
V
RM
I
F
I
FM
I
FSM
T
j
T
stg
Rating
80
80
100
225
500
150
–55 to +150
Unit
V
V
mA
mA
mA
°C
°C
Electrical Characteristics
T
a
= 25°C±3°C
Parameter
Forward voltage
Reverse voltage
Reverse current
Terminal capacitance
Reverse recovery time
*
Symbol
V
F
V
R
I
R
C
t
t
rr
I
F
= 100 mA
I
R
= 100
mA
V
R
= 80 V
V
R
= 0 V, f = 1 MHz
I
F
= 10 mA, V
R
= 6 V, I
rr
= 0.25
×
I
R
80
100
1.2
3
Conditions
Min
Typ
0.92
Max
1.20
Unit
V
V
nA
pF
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 100 MHz
3. *: t
rr
measurement circuit
Bias Application Unit (N-50BU)
Input Pulse
t
r
10%
t
p
t
I
F
Output Pulse
t
rr
t
A
V
R
Wave Form Analyzer
(SAS-8130)
R
i
= 50
Ω
90%
t
p
=
2
µs
t
r
=
0.35 ns
δ =
0.05
Pulse Generator
(PG-10N)
R
s
= 50
Ω
I
rr
=
0.25
×
I
R
I
F
=
10 mA
V
R
= 6 V
Publication date: November 2010
Ver. DED
1
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
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(2) The technical information described in this book is intended onl
of the products. No license is granted in and to any intellectual p
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(3) The products described in this book are intended to be used fo
equipment, measuring instruments and household appliances), o
Consult our sales staff in advance for information on the followi
–
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your using the products described in this book for any special a
this book for any special application.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values,
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
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