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LH28F320BJHE-PBTL90

Description
Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48
Categorystorage    storage   
File Size600KB,58 Pages
ManufacturerSHARP
Websitehttp://sharp-world.com/products/device/
Download Datasheet Parametric View All

LH28F320BJHE-PBTL90 Overview

Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48

LH28F320BJHE-PBTL90 Parametric

Parameter NameAttribute value
MakerSHARP
package instruction12 X 20 MM, PLASTIC, TSOP-48
Reach Compliance Codeunknown
Maximum access time90 ns
Other featuresBOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
JESD-30 codeR-PDSO-G48
JESD-609 codee6
length18.4 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN BISMUTH
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width12 mm

LH28F320BJHE-PBTL90 Preview

P
RODUCT
S
PECIFICATIONS
®
Integrated Circuits Group
LH28F320BJHE-PBTL90
32M (2M x 16/4M × 8)
(Model No.: LHF32J08)
Flash Memory
Spec No.: EL12X044
Issue Date: October 16, 2000
sharp
LHF32J08
●Handle
this document carefully for it contains material protected by international copyright law.
Any reproduction, full or in part, of this material is prohibited without the express written
permission of the company.
●When
using the products covered herein, please observe the conditions written herein and the
precautions outlined in the following paragraphs. In no event shall the company be liable for any
damages resulting from failure to strictly adhere to these conditions and precautions.
(1) The products covered herein are designed and manufactured for the following application
areas. When using the products covered herein for the equipment listed in Paragraph (2),
even for the following application areas, be sure to observe the precautions given in
Paragraph (2). Never use the products for the equipment listed in Paragraph (3).
•Office
electronics
•Instrumentation
and measuring equipment
•Machine
tools
•Audiovisual
equipment
•Home
appliance
•Communication
equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following equipment which
demands high reliability, should first contact a sales representative of the company and then
accept responsibility for incorporating into the design fail-safe operation, redundancy, and
other appropriate measures for ensuring reliability and safety of the equipment and the
overall system.
•Control
and safety devices for airplanes, trains, automobiles, and other
transportation equipment
•Mainframe
computers
•Traffic
control systems
•Gas
leak detectors and automatic cutoff devices
•Rescue
and security equipment
•Other
safety devices and safety equipment, etc.
(3) Do not use the products covered herein for the following equipment which demands
extremely high performance in terms of functionality, reliability, or accuracy.
•Aerospace
equipment
•Communications
equipment for trunk lines
•Control
equipment for the nuclear power industry
•Medical
equipment related to life support, etc.
(4) Please direct all queries and comments regarding the interpretation of the above three
Paragraphs to a sales representative of the company.
●Please
direct all queries regarding the products covered herein to a sales representative of the
company.
Rev. 1.27
sharp
LHF32J08
1
CONTENTS
PAGE
1 INTRODUCTION.............................................................. 3
1.1 Features ........................................................................ 3
1.2 Product Overview......................................................... 3
1.3 Product Description...................................................... 4
1.3.1 Package Pinout ....................................................... 4
1.3.2 Block Organization................................................. 4
2 PRINCIPLES OF OPERATION........................................ 8
2.1 Data Protection............................................................. 8
3 BUS OPERATION ............................................................ 9
3.1 Read.............................................................................. 9
3.2 Output Disable.............................................................. 9
3.3 Standby......................................................................... 9
3.4 Reset............................................................................. 9
3.5 Read Identifier Codes................................................. 10
3.6 OTP(One Time Program) Block ................................ 10
3.7 Write........................................................................... 11
4 COMMAND DEFINITIONS........................................... 11
4.1 Read Array Command................................................ 13
4.2 Read Identifier Codes Command ............................... 13
4.3 Read Status Register Command ................................. 13
4.4 Clear Status Register Command................................. 13
4.5 Block Erase Command............................................... 14
4.6 Full Chip Erase Command ......................................... 14
4.7 Word/Byte Write Command....................................... 14
4.8 Block Erase Suspend Command ................................ 15
4.9 Word/Byte Write Suspend Command ........................ 15
4.10 Set Block and Permanent Lock-Bit Command......... 16
4.11 Clear Block Lock-Bits Command ............................ 16
4.12 OTP Program Command .......................................... 17
4.13 Block Locking by the WP# ...................................... 17
PAGE
5 DESIGN CONSIDERATIONS ....................................... 27
5.1 Three-Line Output Control ........................................ 27
5.2 RY/BY# and WSM Polling ....................................... 27
5.3 Power Supply Decoupling ......................................... 27
5.4 V
CCW
Trace on Printed Circuit Boards ..................... 27
5.5 V
CC
, V
CCW
, RP# Transitions .................................... 27
5.6 Power-Up/Down Protection....................................... 28
5.7 Power Dissipation ...................................................... 28
5.8 Data Protection Method ............................................. 28
6 ELECTRICAL SPECIFICATIONS ................................ 29
6.1 Absolute Maximum Ratings ...................................... 29
6.2 Operating Conditions ................................................. 29
6.2.1 Capacitance .......................................................... 29
6.2.2 AC Input/Output Test Conditions ........................ 30
6.2.3 DC Characteristics ............................................... 31
6.2.4 AC Characteristics - Read-Only Operations ........ 33
6.2.5 AC Characteristics - Write Operations ................ 36
6.2.6 Alternative CE#-Controlled Writes...................... 38
6.2.7 Reset Operations .................................................. 40
6.2.8 Block Erase, Full Chip Erase, Word/Byte Write and
Lock-Bit Configuration Performance ................. 41
7 PACKAGE AND PACKING SPECIFICATIONS.......... 42
Rev. 1.27
sharp
LHF32J08
2
LH28F320BJHE-PBTL90
32M-BIT ( 2Mbit ×16 / 4Mbit ×8 )
Boot Block Flash MEMORY
Low Voltage Operation
V
CC
=V
CCW
=2.7V-3.6V Single Voltage
Enhanced Automated Suspend Options
Word/Byte Write Suspend to Read
Block Erase Suspend to Word/Byte Write
Block Erase Suspend to Read
OTP(One Time Program) Block
3963 word + 4 word Program only array
User-Configurable ×8 or ×16 Operation
High-Performance Read Access Time
90ns(V
CC
=2.7V-3.6V)
Enhanced Data Protection Features
Operating Temperature
-40°C to +85°C
Absolute Protection with V
CCW
≤V
CCWLK
Block Erase, Full Chip Erase, Word/Byte Write and
Lock-Bit Configuration Lockout during Power
Transitions
Block Locking with Command and WP#
Permanent Locking
Low Power Management
Typ. 4µA (V
CC
=3.0V) Standby Current
Automatic Power Savings Mode Decreases I
CCR
in
Static Mode
Typ. 120µA (V
CC
=3.0V, T
A
=+25°C, f=32kHz)
Read Current
Automated Block Erase, Full Chip Erase,
Word/Byte Write and Lock-Bit Configuration
Command User Interface (CUI)
Status Register (SR)
SRAM-Compatible Write Interface
Industry-Standard Packaging
48-Lead TSOP
Optimized Array Blocking Architecture
Two 4K-word (8K-byte) Boot Blocks
Six 4K-word (8K-byte) Parameter Blocks
Sixty-three 32K-word (64K-byte) Main Blocks
Bottom Boot Location
ETOX
TM*
Nonvolatile Flash Technology
CMOS Process (P-type silicon substrate)
Not designed or rated as radiation hardened
Extended Cycling Capability
Minimum 100,000 Block Erase Cycles
SHARP’s LH28F320BJHE-PBTL90 Flash memory is a high-density, low-cost, nonvolatile, read/write storage solution for a
wide range of applications.
LH28F320BJHE-PBTL90 can operate at V
CC
=2.7V-3.6V and V
CCW
=2.7V-3.6V or 11.7V-12.3V. Its low voltage operation
capability realize battery life and suits for cellular phone application.
Its Boot, Parameter and Main-blocked architecture, low voltage and extended cycling provide for highly flexible component
suitable for portable terminals and personal computers. Its enhanced suspend capabilities provide for an ideal solution for code
+ data storage applications.
For secure code storage applications, such as networking, where code is either directly executed out of flash or downloaded to
DRAM, the LH28F320BJHE-PBTL90 offers four levels of protection: absolute protection with V
CCW
≤V
CCWLK
, selective
hardware block locking or flexible software block locking. These alternatives give designers ultimate control of their code
security needs.
The LH28F320BJHE-PBTL90 is manufactured on SHARP’s 0.25µm ETOX
TM*
process technology. It come in industry-
standard package: the 48-lead TSOP, ideal for board constrained applications.
*ETOX is a trademark of Intel Corporation.
Rev. 1.27

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