ISDMICROTAD-16MS datasheet, PDF

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ISDMICROTAD-16MS: DescriptionSpeech Synthesizer With RCDG, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28; CategoryAnalog mixed-signal IC Consumption circuit; File Size649KB，28 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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ISDMICROTAD-16MS Overview

Speech Synthesizer With RCDG, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28

ISDMICROTAD-16MS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	0.300 INCH, PLASTIC, SOIC-28
Contacts	28
Reach Compliance Code	not_compliant
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	17.9 mm
Number of functions	1
Number of terminals	28
Maximum operating temperature	50 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP28,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum slew rate	40 mA
Maximum supply voltage (Vsup)	3.15 V
Minimum supply voltage (Vsup)	2.85 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.5 mm

ISDMICROTAD-16MS Preview

Table of Contents

DETAILED DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Speech/Sound Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Flash Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Microcontroller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

PIN DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Voltage Inputs (V

CCA

, V

CCD

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ground Inputs (V

SSA

, V

SSD

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Non-Inverting Analog Input (ANA IN+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Inverting Analog Input (ANA IN–) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Audio Output (AUD OUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Slave Select (SS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Master Out Slave In (MOSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Master In Slave Out (MISO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Serial Clock (SCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Interrupt (INT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Row Address Clock (RAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

External Clock Input (XCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

AutoMute™ Feature (AM CAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Message Cueing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

SPI Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

SPI Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

TIMING DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

DEVICE PHYSICAL DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

ISD

iii

ISD MicroTAD-16M

FIGURES, CHARTS, AND TABLES IN THE ISD MICROTAD-16M DATA SHEET

Figure 1:

Figure 2:

Figure 3:

Figure 4:

Figure 5:

Figure 6:

Figure 7:

Figure 8:

Figure 9:

Figure 10:

Figure 11:

Figure 12:

Figure 13:

Figure 14:

Figure 15:

ISD MicroTAD-16M TSOP and PDIP/SOIC Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

ISD MicroTAD-16M ANA IN Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

SPI Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

SPI Interface Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

8-Bit Command Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

24-Bit Command Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Playback/Record and Stop Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Application Example Using SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Application Example Using Microwire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Application Example Using SPI Port on Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

28-Lead 8x13.4 mm Plastic Thin Small Outline Package (TSOP) Type I (E) . . . . . . . . . . . . .18

28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P) . . . . . . . . . . . . . . . . . . . . . . . . .19

28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S) . . . . . . . . . . . . . . .20

ISD MicroTAD-16M Bonding Physical Layout (Unpackaged Die) . . . . . . . . . . . . . . . . . . . .21

Table 1:

Table 2:

Table 3:

Table 4:

Table 5:

Table 6:

Table 7:

Table 8:

Table 9:

Table 10:

Table 11:

Table 12:

Table 13:

Table 14:

Table 15:

Table 16:

External Clock Input Clocking Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Opcode Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

SPI Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Absolute Maximum Ratings (Packaged Parts). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Operating Conditions (Packaged Parts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

DC Parameters (Packaged Parts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

AC Parameters (Packaged Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Absolute Maximum Ratings (Die). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Operating Conditions (Die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

DC Parameters (Die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

AC Parameters (Die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

SPI AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions. . . . . . . . . . . . . . . . . . . . .18

Plastic Dual Inline Package (PDIP) (P) Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions. . . . . . . . . . . . . . . . . . . . . . .20

ISD MicroTAD-16M Device Pin/Pad Designations, with Respect to Die Center (mm) . . . .22

Voice Solutions in Silicon™

A Winbond Company

ISD MicroTAD-16M

Single-Chip Voice Record/Playback Device

16-Minute Duration

Preliminary Data Sheet

GENERAL DESCRIPTION

The ISD MicroTAD-16M ChipCorder

Product pro-

vides high-quality, 3-volt, single-chip record/

playback solutions for 16-minute messaging ap-

plications which are ideal for telephone answer-

ing devices (TADs). The CMOS-based devices

include an on-chip oscillator, antialiasing filter,

smoothing filter, AutoMute™ feature, audio am-

plifier, and high density, multilevel Flash storage

array. The ISD MicroTAD-16M is designed to be

used in a microprocessor- or microcontroller-

based system. Address and control are accom-

plished through a Serial Peripheral Interface (SPI)

or Microwire Serial Interface to minimize pin

count.

Recordings are stored in on-chip nonvolatile

memory cells, providing zero-power message

storage. This unique, single-chip solution is made

possible through ISD’s patented multilevel stor-

age technology. Voice and audio signals are

stored directly into memory in their natural form,

providing high-quality, solid-state voice repro-

duction.

Figure: ISD MicroTAD-16M Block Diagram

May 1999

ISD · 2727 North First Street, San Jose, CA 95125 · TEL: 408/943-6666 · FAX: 408/544-1787 · http://www.isd.com

ISD MicroTAD-16M

FEATURES

Single-chip voice record/playback solution

Single +3 volt supply

Low-power consumption

Operating current:

Play = 15 mA (typical)

Rec = 25 mA (typical)

Standby current: 1 µA (typical)

Single-chip duration of 16 minutes

4.0 KHz sample rate

Typical band pass filter 1.7 KHz

High-quality, natural voice/audio

reproduction

AutoMute feature provides background

noise attenuation during periods of silence

No algorithm development required

Microcontroller SPI or Microwire™ Serial

Interface

Fully addressable to handle multiple

messages

Nonvolatile message storage

Power consumption controlled by SPI

or Microwire control register

100-year message retention (typical)

100K record cycles (typical)

On-chip clock source

Available in die form, PDIP, SOIC, and TSOP

Voice Solutions in Silicon

™

ISD MicroTAD-16M

DETAILED DESCRIPTION

SPEECH/SOUND QUALITY

The ISD MicroTAD-16M ChipCorder is offered at

4.0 KHz sampling frequency.

The speech samples are stored directly into on-

chip nonvolatile memory without the digitization

and compression associated with other solu-

tions. Direct analog storage provides a natural

sounding reproduction of voice, music, tones,

and sound effects not available with most solid-

state solutions.

PIN DESCRIPTIONS

VOLTAGE INPUTS (V

CCA

, V

CCD

)

To minimize noise, the analog and digital circuits

in the ISD MicroTAD-16M device use separate pow-

er busses. These +3 V busses are brought out to

separate pins and should be tied together as

close to the supply as possible. In addition, these

supplies should be decoupled as close to the

package as possible.

GROUND INPUTS (V

SSA

, V

SSD

)

The ISD MicroTAD-16M utilizes separate analog

and digital ground busses. The analog ground

SSA

) pins should be tied together as close to

the package as possible and connected

through a low-impedance path to power supply

ground. The digital ground (V

SSD

) pin should be

connected through a separate low-impedance

path to power supply ground. These ground

paths should be large enough to ensure that the

impedance between the V

SSA

pins and the V

SSD

pin is less than 3

Ω

. The backside of the die is con-

nected to V

through the substrate resistance.

In a chip-on-board design, the die attach area

must be connected to V

or left floating.

FLASH STORAGE

One of the benefits of ISD’s ChipCorder technolo-

gy is the use of on-chip nonvolatile memory, which

provides zero-power message storage. The mes-

sage is retained for up to 100 years (typically)

without power. In addition, the device can be

re-recorded (typically) over 100,000 times.

MICROCONTROLLER INTERFACE

A four-wire (SCLK, MOSI, MISO, SS) SPI interface is

provided for ISD MicroTAD-16M control and ad-

dressing functions. The ISD MicroTAD-16M is con-

figured to operate as a peripheral slave device,

with a microcontroller-based SPI bus interface.

Read/Write access to all the internal registers oc-

curs through this SPI interface. An interrupt signal

(INT) and internal read-only Status Register are

provided for handshake purposes.

PROGRAMMING

The ISD MicroTAD-16M is also ideal for playback-

only applications, where single or multiple mes-

sage Playback is controlled through the SPI port.

Once the desired message configuration is creat-

ed, duplicates can easily be generated via an

ISD programmer or a 3rd party programmer.

ISD

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ISDMICROTAD-16MS Related Products

	ISDMICROTAD-16MS	ISDMICROTAD-16ME	ISDMICROTAD-16MP	ISDMICROTAD-16MX
Description	Speech Synthesizer With RCDG, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28	Speech Synthesizer With RCDG, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	Speech Synthesizer With RCDG, CMOS, 4.23 X 9.78 MM, 0.30 MM HEIGHT, DIE-19
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	SOIC	TSOP	DIP	DIE
package instruction	0.300 INCH, PLASTIC, SOIC-28	8 X 13.40 MM, PLASTIC, TSOP1-28	0.600 INCH, PLASTIC, DIP-28	DIE,
Contacts	28	28	28	19
Reach Compliance Code	not_compliant	not_compliant	not_compliant	unknown
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-XUUC-N19
Number of functions	1	1	1	1
Number of terminals	28	28	28	19
Maximum operating temperature	50 °C	50 °C	50 °C	50 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	SOP	TSOP1	DIP	DIE
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	IN-LINE	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V
Minimum supply voltage (Vsup)	2.85 V	2.85 V	2.85 V	2.85 V
surface mount	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	DUAL	UPPER
Is it Rohs certified?	incompatible	incompatible	incompatible	-
JESD-609 code	e0	e0	e0	-
length	17.9 mm	11.8 mm	36.83 mm	-
Encapsulate equivalent code	SOP28,.4	TSSOP28,.53,22	DIP28,.6	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	3 V	3 V	3 V	-
Maximum seat height	2.65 mm	1.2 mm	4.83 mm	-
Maximum slew rate	40 mA	40 mA	40 mA	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal pitch	1.27 mm	0.55 mm	2.54 mm	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	7.5 mm	8 mm	15.24 mm	-

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Switching power supply spike suppression

1 Introduction Power supply ripple will interfere with the normal operation of electronic equipment, causing malfunctions such as computer crashes, data processing errors and control system fa...[Details]

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