EMDS13E2H-150.000MTR datasheet, PDF

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EMDS13E2H-150.000MTR: DescriptionCRYSTAL OSCILLATOR, CLOCK, 150MHz, LVDS OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN; CategoryPassive components oscillator; File Size276KB，6 Pages; ManufacturerECLIPTEK; Websitehttp://www.ecliptek.com; Environmental Compliance

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EMDS13E2H-150.000MTR Overview

CRYSTAL OSCILLATOR, CLOCK, 150MHz, LVDS OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN

EMDS13E2H-150.000MTR Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ECLIPTEK
Reach Compliance Code	compliant
Other features	ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TAPE AND REEL
maximum descent time	0.325 ns
Frequency Adjustment - Mechanical	NO
frequency stability	25%
JESD-609 code	e4
Manufacturer's serial number	EMDS13
Installation features	SURFACE MOUNT
Nominal operating frequency	150 MHz
Maximum operating temperature	70 °C
Minimum operating temperature
Oscillator type	LVDS
Output load	100 OHM
physical size	7.0mm x 5.0mm x 0.85mm
longest rise time	0.325 ns
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
maximum symmetry	55/45 %
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)

EMDS13E2H-150.000MTR Preview

EMDS13E2H-150.000M TR

Series

RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm

Plastic SMD LVDS MEMS Oscillator

Frequency Tolerance/Stability

±25ppm Maximum over 0°C to +70°C

Duty Cycle

50 ±5(%)

RoHS

Packaging Options

Tape & Reel

EMDS13 E 2 H -150.000M TR

Nominal Frequency

150.000MHz

Logic Control / Additional Output

Output Enable (OE) and Complementary Output

ELECTRICAL SPECIFICATIONS

Nominal Frequency

Frequency Tolerance/Stability

150.000MHz

±25ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency

Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year

Aging at 25°C, Reflow, Shock, and Vibration)

±1ppm First Year Maximum

+3.3Vdc ±0.3Vdc

80mA Maximum (Excluding Load Termination Current)

1.425Vdc Typical

1.075Vdc Typical

247mVdc Minimum, 350mVdc Typical, 454mVdc Maximum

1.125V Minimum, 1.250V Typical, 1.375V Maximum

225pSec Typical, 325pSec Maximum (Measured over 20% to 80% of waveform)

50mVdc Maximum

50 ±5(%) (Measured at 50% of waveform)

50mVdc Maximum

100 Ohms Between Output and Complementary Output

LVDS

Output Enable (OE) and Complementary Output

Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc

Maximum to Disable Output and Complementary Output (High Impedance)

75mA Maximum (OE) Without Load

0.2pSec Typical

2.0pSec Typical

1.8pSec Typical, 2.5pSec Maximum

25pSec Typical, 30pSec Maximum

1.7pSec Typical

1.2pSec Typical

0.7pSec Typical

10mSec Maximum

-55°C to +125°C

Aging at 25°C

Supply Voltage

Input Current

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Differential Output Voltage (Vod)

Offset Voltage (Vos)

Rise/Fall Time

Differential Output Error (dVod)

Duty Cycle

Offset Error (dVos)

Load Drive Capability

Output Logic Type

Logic Control / Additional Output

Output Control Input Voltage

Output Enable Current

Period Jitter (Deterministic)

Period Jitter (Random)

Period Jitter (RMS)

Period Jitter (pk-pk)

RMS Phase Jitter (Fj = 637kHz to

10MHz; Random)

RMS Phase Jitter (Fj = 1MHz to

20MHz; Random)

RMS Phase Jitter (Fj = 1.875MHz to

20MHz; Random)

Start Up Time

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

Flammability

Mechanical Shock

Moisture Resistance

Moisture Sensitivity Level

Resistance to Soldering Heat

Resistance to Solvents

Solderability

Temperature Cycling

MIL-STD-883, Method 3015, Class 2, HBM 2000V

UL94-V0

MIL-STD-883, Method 2002, Condition G, 30,000G

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)

MIL-STD-883, Method 1010, Condition B

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 6

EMDS13E2H-150.000M TR

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Thermal Shock

Vibration

MIL-STD-883, Method 1011, Condition B

MIL-STD-883, Method 2007, Condition A, 20G

MECHANICAL DIMENSIONS (all dimensions in millimeters)

5.00

±0.15

0.85

±0.15

0.08

MAX

7.00

±0.15

5.08

±0.10

CONNECTION

Output Enable (OE)

No Connect

Case Ground

Output

Complementary Output

Supply Voltage

1.20 ±0.10 (x4)

1.47

2.30

LINE MARKING

2.54 TYP

2.60

±0.15

1.40

±0.10 (x4)

XXXX or XXXXX

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

Note A: Center paddle is connected

internally to oscillator ground (Pad 3).

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.80 (X6)

2.00 (X6)

0.54 (X4)

2.39 (X3)

All Tolerances are ±0.1

Solder Land

(X6)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 6

EMDS13E2H-150.000M TR

OUTPUT WAVEFORM & TIMING DIAGRAM

TRI-STATE INPUT

Q & Q OUTPUTS

HIGH IMPEDANCE

STATE

Q MINUS Q OUTPUT

80%

Op-p

HIGH IMPEDANCE

STATE

20%

PLZ

Fall

Time

Rise

Time

Duty Cycle (%) = T

/T x 100

PZL

Test Circuit for Tri-State and Complementary Output

Oscilloscope

Frequency

Counter

Current

Meter

0.01µF

(Note 1)

Supply

Voltage

)

Probe 2

(Note 2)

Probe 1

(Note 2)

100 Ohms

Complementary

Output

Switch

0.1µF

(Note 1)

Ground

Power

Supply

Voltage

Meter

Power

Supply

Tri-State

Connect

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)

to the package ground and supply voltage pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is

recommended.

Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 6

EMDS13E2H-150.000M TR

Tape & Reel Dimensions

Quantity Per Reel: 1,000 units

4.0 ±0.2

2.0 ±0.2

DIA 1.5 ±0.1

0.30 ±0.05

7.5 ±0.2

16.0 ±0.3

6.75 ±0.20

A0*

8.0 ±0.2

*Compliant to EIA 481A

B0*

K0*

1.5 MIN

DIA 40 MIN

Access Hole at

Slot Location

22.4 MAX

180 MAX

DIA 50 MIN

DIA 20.2 MIN

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

16.4 +2.0/-0

DIA 13.0 ±0.2

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 6

EMDS13E2H-150.000M TR

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

3°C/second Maximum

150°C

175°C

200°C

60 - 180 Seconds

3°C/second Maximum

217°C

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 6

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