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KS57C0108IFP

Description
Microcontroller, 4-Bit, MROM, CMOS, PQFP44, 10 X 10 MM, QFP-44
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size252KB,16 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KS57C0108IFP Overview

Microcontroller, 4-Bit, MROM, CMOS, PQFP44, 10 X 10 MM, QFP-44

KS57C0108IFP Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeQFP
package instructionQFP,
Contacts44
Reach Compliance Codeunknown
Has ADCNO
Address bus width
bit size4
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G44
length10 mm
Number of I/O lines36
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Certification statusNot Qualified
ROM programmabilityMROM
Maximum seat height2.3 mm
Maximum slew rate8 mA
Maximum supply voltage6 V
Minimum supply voltage2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

KS57C0108IFP Related Products

KS57C0108IFP KS57C0108IS KS57C0104IFP
Description Microcontroller, 4-Bit, MROM, CMOS, PQFP44, 10 X 10 MM, QFP-44 Microcontroller, 4-Bit, MROM, CMOS, PDIP42, 0.600 INCH, SDIP-42 Microcontroller, 4-Bit, MROM, CMOS, PQFP44, 10 X 10 MM, QFP-44
Maker SAMSUNG SAMSUNG SAMSUNG
Parts packaging code QFP DIP QFP
package instruction QFP, SDIP, QFP,
Contacts 44 42 44
Reach Compliance Code unknown unknown unknown
Has ADC NO NO NO
bit size 4 4 4
DAC channel NO NO NO
DMA channel NO NO NO
JESD-30 code S-PQFP-G44 R-PDIP-T42 S-PQFP-G44
length 10 mm 39.1 mm 10 mm
Number of I/O lines 36 36 36
Number of terminals 44 42 44
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
PWM channel NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP SDIP QFP
Package shape SQUARE RECTANGULAR SQUARE
Package form FLATPACK IN-LINE, SHRINK PITCH FLATPACK
Certification status Not Qualified Not Qualified Not Qualified
ROM programmability MROM MROM MROM
Maximum seat height 2.3 mm 5.08 mm 2.3 mm
Maximum slew rate 8 mA 8 mA 8 mA
Maximum supply voltage 6 V 6 V 6 V
Minimum supply voltage 2.7 V 2.7 V 2.7 V
surface mount YES NO YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE GULL WING
Terminal pitch 0.8 mm 1.778 mm 0.8 mm
Terminal location QUAD DUAL QUAD
width 10 mm 15.24 mm 10 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
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