ZMM5221B ~ ZMM5261B
500mW SUFACE MOUNT ZENER DIODE
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb
Pb free: 98.5% Sn above
0.063(1.6)
0.055(1.4)
DIA.
MINI-MELF / LL-34
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.03 grams
• Mounting Position: Any
0.020(0.5)
0.012(0.3)
0.146(3.7)
0.130(3.3)
0.020(0.5)
0.012(0.3)
Dimensions in inches and (millimeters)
ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)
(T
A
=25℃ )
Symbols
Zener current see table "Characteristics"
Power dissipation at T
A
=25℃
Junction temperature
Storage temperature range
P
tot
T
J
T
STG
Value
Units
mW
500
1)
175
-55 to + 175
℃
℃
1)Valid provided that at a distance of 8mm from case are kept at ambient temperature
ELECTRICAL CHARACTERISTICS
(TA=25℃ )
Symbols
Thermal resistance junction to ambient
Forward voltage
at I
F
=100mA
R
THA
V
F
Min.
Typ.
Max.
0.3
1)
1.1
Units
K
/mW
V
1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature
ZMM5221B ~ ZMM5261B
RATINGS AND CHARACTERISTIC CURVES
FIG.1- BREAKDOWN CHARACTERISTICS
Vz (V)
5
10
15
20
25
30
Iz (mA)
50
40
30
20
10
0
Test Current
Iz = 20mA
5252
5250
5245
5242
5241
5239
5235
5234
5232
5231
5230
5229
500
400
300
200
100
5228
Pd(mW)
Power Dissipation
5224
FIG.2- POWER ,TEMPERATURE DERATING CURVE
50
100
150
200
300
T
A
(
o
C)
Ambient Temperature
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