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SG55452BF

Description
NAND Gate Based Peripheral Driver, 0.4A, BIPolar
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size107KB,3 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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SG55452BF Overview

NAND Gate Based Peripheral Driver, 0.4A, BIPolar

SG55452BF Parametric

Parameter NameAttribute value
MakerMicrosemi
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
Input propertiesSTANDARD
Interface integrated circuit typeNAND GATE BASED PERIPHERAL DRIVER
JESD-30 codeR-CDFP-F
Number of functions2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristicsOPEN-COLLECTOR
Output current flow directionSINK
Nominal output peak current0.4 A
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formFLATPACK
Certification statusNot Qualified
Maximum slew rate71 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyBIPOLAR
Temperature levelMILITARY
Terminal formFLAT
Terminal locationDUAL
Disconnect time0.035 µs
connection time0.035 µs

SG55452BF Related Products

SG55452BF SG75462F SG55462F/883B SG75452BF SG55452BF/883B SG55462F
Description NAND Gate Based Peripheral Driver, 0.4A, BIPolar NAND Gate Based Peripheral Driver, 0.4A, BIPolar NAND Gate Based Peripheral Driver, 0.4A, BIPolar NAND Gate Based Peripheral Driver, 0.4A, BIPolar NAND Gate Based Peripheral Driver, 0.4A, BIPolar NAND Gate Based Peripheral Driver, 0.4A, BIPolar
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Input properties STANDARD STANDARD STANDARD STANDARD STANDARD STANDARD
Interface integrated circuit type NAND GATE BASED PERIPHERAL DRIVER NAND GATE BASED PERIPHERAL DRIVER NAND GATE BASED PERIPHERAL DRIVER NAND GATE BASED PERIPHERAL DRIVER NAND GATE BASED PERIPHERAL DRIVER NAND GATE BASED PERIPHERAL DRIVER
JESD-30 code R-CDFP-F R-CDFP-F R-CDFP-F R-CDFP-F R-CDFP-F R-CDFP-F
Number of functions 2 2 2 2 2 2
Maximum operating temperature 125 °C 70 °C 125 °C 70 °C 125 °C 125 °C
Minimum operating temperature -55 °C - -55 °C - -55 °C -55 °C
Output characteristics OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR
Output current flow direction SINK SINK SINK SINK SINK SINK
Nominal output peak current 0.4 A 0.4 A 0.4 A 0.4 A 0.4 A 0.4 A
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 71 mA 76 mA 76 mA 71 mA 71 mA 76 mA
Maximum supply voltage 5.5 V 5.25 V 5.5 V 5.25 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.75 V 4.5 V 4.75 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY COMMERCIAL MILITARY COMMERCIAL MILITARY MILITARY
Terminal form FLAT FLAT FLAT FLAT FLAT FLAT
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Disconnect time 0.035 µs 0.065 µs 0.065 µs 0.035 µs 0.035 µs 0.065 µs
connection time 0.035 µs 0.05 µs 0.05 µs 0.035 µs 0.035 µs 0.05 µs
Maker Microsemi Microsemi Microsemi - Microsemi Microsemi
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