DIODE 0.6 A, 600 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode
| Parameter Name | Attribute value |
| Maker | NXP |
| package instruction | O-LELF-R2 |
| Contacts | 2 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| JESD-30 code | O-LELF-R2 |
| JESD-609 code | e3 |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum operating temperature | 150 °C |
| Minimum operating temperature | -65 °C |
| Maximum output current | 0.6 A |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Certification status | Not Qualified |
| Maximum repetitive peak reverse voltage | 600 V |
| Maximum reverse recovery time | 0.25 µs |
| surface mount | YES |
| Terminal surface | TIN |
| Terminal form | WRAP AROUND |
| Terminal location | END |

| PRS07J,115 | PRS07D,135 | PRS07G | PRS07J | PRS07D | PRS07G,135 | PRS07J,135 | PRS07D,115 | PRS07G,115 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | DIODE 0.6 A, 600 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode | 0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 0.6A, 400V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | DIODE 0.6 A, 600 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode | 0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 0.6A, 400V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | DIODE 0.6 A, 600 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode | 0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 0.6A, 400V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2 |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
| package instruction | O-LELF-R2 | O-LELF-R2 | HERMETIC SEALED, GLASS PACKAGE-2 | HERMETIC SEALED, GLASS PACKAGE-2 | HERMETIC SEALED, GLASS PACKAGE-2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 |
| Contacts | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| JESD-30 code | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| Maximum output current | 0.6 A | 0.6 A | 0.6 A | 0.6 A | 0.6 A | 0.6 A | 0.6 A | 0.6 A | 0.6 A |
| Package body material | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum repetitive peak reverse voltage | 600 V | 200 V | 400 V | 600 V | 200 V | 400 V | 600 V | 200 V | 400 V |
| Maximum reverse recovery time | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| Terminal surface | TIN | TIN | TIN | TIN | TIN | TIN | TIN | TIN | TIN |
| Terminal form | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND |
| Terminal location | END | END | END | END | END | END | END | END | END |
| Minimum operating temperature | -65 °C | -65 °C | - | - | - | -65 °C | -65 °C | -65 °C | -65 °C |