FIFO, 1KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFJ |
| package instruction | QCCJ, |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| Other features | RETRANSMIT |
| period time | 35 ns |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 9216 bit |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX9 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum seat height | 3.55 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 20 |
| width | 11.43 mm |
| IDT72021L25J8 | LP2128LT1G | IDT72041L35J8 | 52-PV0H240SS211_18 | 52-PV2F640SS | IDT72031L35J8 | IDT72041L50J8 | |
|---|---|---|---|---|---|---|---|
| Description | FIFO, 1KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | 20V P-Channel Enhancement-Mode MOSFET | FIFO, 4KX9, 35ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | HARDWARE INCLUDED: HEX NUT AND O-RING (NOT SHOWN) | ALL DIMENSIONS IN MM [INCH] | FIFO, 2KX9, 35ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | FIFO, 4KX9, 50ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 |
| Is it lead-free? | Contains lead | - | Contains lead | - | - | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | - | incompatible | - | - | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | QFJ | - | QFJ | - | - | QFJ | QFJ |
| package instruction | QCCJ, | - | QCCJ, | - | - | QCCJ, | QCCJ, |
| Contacts | 32 | - | 32 | - | - | 32 | 32 |
| Reach Compliance Code | compliant | - | compliant | - | - | compliant | compliant |
| ECCN code | EAR99 | - | EAR99 | - | - | EAR99 | EAR99 |
| Maximum access time | 25 ns | - | 35 ns | - | - | 35 ns | 50 ns |
| Other features | RETRANSMIT | - | RETRANSMIT | - | - | RETRANSMIT | RETRANSMIT |
| period time | 35 ns | - | 45 ns | - | - | 45 ns | 65 ns |
| JESD-30 code | R-PQCC-J32 | - | R-PQCC-J32 | - | - | R-PQCC-J32 | R-PQCC-J32 |
| JESD-609 code | e0 | - | e0 | - | - | e0 | e0 |
| length | 13.97 mm | - | 13.97 mm | - | - | 13.97 mm | 13.97 mm |
| memory density | 9216 bit | - | 36864 bit | - | - | 18432 bit | 36864 bit |
| memory width | 9 | - | 9 | - | - | 9 | 9 |
| Number of functions | 1 | - | 1 | - | - | 1 | 1 |
| Number of terminals | 32 | - | 32 | - | - | 32 | 32 |
| word count | 1024 words | - | 4096 words | - | - | 2048 words | 4096 words |
| character code | 1000 | - | 4000 | - | - | 2000 | 4000 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | - | 70 °C | - | - | 70 °C | 70 °C |
| organize | 1KX9 | - | 4KX9 | - | - | 2KX9 | 4KX9 |
| Output characteristics | 3-STATE | - | 3-STATE | - | - | 3-STATE | 3-STATE |
| Exportable | YES | - | YES | - | - | YES | YES |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | - | QCCJ | - | - | QCCJ | QCCJ |
| Package shape | RECTANGULAR | - | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | - | CHIP CARRIER | - | - | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | - | PARALLEL | - | - | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | - | 225 | - | - | 225 | 225 |
| Certification status | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified |
| Maximum seat height | 3.55 mm | - | 3.55 mm | - | - | 3.55 mm | 3.55 mm |
| Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | - | - | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | - | - | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | - | - | 5 V | 5 V |
| surface mount | YES | - | YES | - | - | YES | YES |
| technology | CMOS | - | CMOS | - | - | CMOS | CMOS |
| Temperature level | COMMERCIAL | - | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | - | TIN LEAD | - | - | TIN LEAD | TIN LEAD |
| Terminal form | J BEND | - | J BEND | - | - | J BEND | J BEND |
| Terminal pitch | 1.27 mm | - | 1.27 mm | - | - | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | - | QUAD | - | - | QUAD | QUAD |
| Maximum time at peak reflow temperature | 20 | - | 30 | - | - | 20 | 30 |
| width | 11.43 mm | - | 11.43 mm | - | - | 11.43 mm | 11.43 mm |
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