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BCM5706

Description
Telecom Circuit, 1-Func, CMOS, PBGA400, 21 X 21 MM, TFBGA-400
CategoryWireless rf/communication    Telecom circuit   
File Size125KB,2 Pages
ManufacturerQLogic Corporation
Download Datasheet Parametric Compare View All

BCM5706 Overview

Telecom Circuit, 1-Func, CMOS, PBGA400, 21 X 21 MM, TFBGA-400

BCM5706 Parametric

Parameter NameAttribute value
MakerQLogic Corporation
package instructionBGA,
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B400
Humidity sensitivity level1
Number of functions1
Number of terminals400
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED

BCM5706 Preview

BCM5706
®
10/100/1000BASE-T TCP OFFLOAD ENGINE, RDMA, ISCSI/ISER AND
ETHERNET CONTROLLER
FEATURES
Single-chip solution for LAN on Motherboard (LOM) and
Network Interface Card (NIC) applications
Integrated 10BASE-T/100BASE-TX/1000BASE-T transceivers
Integrated SerDes (BCM5706S)
Host interfaces
- PCI v2.3—32/64 bits, 33/66 MHz
- PCI-X v1.0—64 bits, 66/100/133 MHz
TCP offload engine
Full “fast Path” TCP offload
Designed for Microsoft’s TOE Chimney Architecture
iSCSI controller
iSCSI initiator
iSER (iSCSI over RDMA)
RDMA controller (RNIC)
RDMA over TCP (iWARP)—RDMAC 1.0 compliant
Hardware-based data placement in application buffers without
CPU intervention (for User and Kernel modes)
Other performance features
TCP, IP checksum
TCP segmentation
Adaptive interrupts
Message Signal Interrupt (MSI) support
Robust manageability
PXE 2.0 remote boot
Alert Standard Format (ASF v1.0) support
Wake-On LAN
IPMI 'pass-through' mode
Statistic gathering (SNMP MIB II, Ethernet like MIB, Ethernet
MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
ACPI 1.1a compliant—power management
Advanced network features
Virtual LANs—802.1q VLAN tagging
Jumbo frames (9 KB)
802.3x flow control
Low-power CMOS design
On-chip power circuit controller
400-ball 21x21 mm FBGA package
3.3V I/Os
JTAG
SUMMARY OF BENEFITS
Industry’s smallest 10/100/1000 TOE solution—power and
space optimized for LOM and low-profile NIC applications.
Extremely low CPU utilization for TCP/IP applications
Host CPU is free to run application code
Easy integration with Microsoft’s TOE Chimney Architecture
Accelerated IP-based storage
Lower CPU utilization for file-level storage protocols such as
CIFS and NFS
iSCSI functionality with low CPU utilization
RDMA support for data placement in application buffers
reduces CPU utilization and lowers data transit latencies. The
result is improved application performance and faster user
response time.
Interoperable with:
Broadcom’s Gigabit controller family – BCM570x
Existing Ethernet 10/100/1000 network infrastructure
Future-proof
Flexible implementation for TCP, iWARP and iSCSI can
accommodate specification changes and interoperability issues
Performance-focused – optimized for throughput and CPU
utilization
Adaptive interrupts
MSI allows interrupt distribution in a multi-CPU host system
Support for PCI-X—allows sufficient bandwidth for wire
speed operation
Robust and highly manageable
PXE 2.0, ACPI 1.1, Wake-On LAN, ASF 1.0
Integrated cable testing—link quality, length, pair skew, pair
polarity, pair swap
IPMI 'pass-through' capability allows on-board management
controllers access to the network in OS-present and OS-absent
states
Server class reliability, availability and performance features
Link aggregation and load balancing
- Switch-dependent
802.3ad (LACP), generic trunking (GEC/FEC)
- Switch and NIC independent
PCI hot plug
Low power for zero airflow implementations
Advanced power management
Minimal real estate—ideal for LOM
On-chip power circuit controller
OVERVIEW
RX
10/100/1000
PHY
TX
10/100/1000
MAC
Dual Processor
Memory Controller
Buffer
Memory
PCI/PCI-X
25 MHz
PLL
Memory
TCP,
RDMA,
iSCSI
Context
TCP,
RDMA,
iSCSI
Code
PCI/PCI-X
Bus
LED Control
SMBus
EEPROM
Control
EEPROM Interface
PLL
PCI
Clk
LED Signals
SMB Interface
The
BCM5706
provides a fully integrated Layer 4 and Layer 5 solution
- TCP/IP, RDMA and iSCSI 1.0/iSER along with a complete 10/100/
1000BASE-T Gigabit Ethernet, IEEE 802.3 compliant Media Access
Control (MAC) and Physical Layer Transceiver solution for high
performance network applications. By itself the
BCM5706
provides a
complete single-chip Gigabit Ethernet NIC with a TCP/IP Offload
Engine, RDMA NIC (RNIC), iSCSI 1.0/iSER HBA or LOM solution.
The
BCM5706
is different from other network controllers because it can
process the TCP/IP and relevant L5 protocols on data directly from the
application buffers on the host, therefore relieving the host CPU from
these time-consuming operations. On the receive path, the
BCM5706
processes the frame up to the highest layer supported present in it, e.g.,
the
BCM5706
processes the frame for RDMA when the frame is an
RDMA frame.
With the appropriate configuration, the
BCM5706
can simultaneously
support any two of the following three functions:
RDMA Network Interface Controller (RNIC)
iSCSI or iSER Host Bus Adapter
TOE Chimney enabled network accelerator
Target Applications of the BCM5706
Gigabit Ethernet NICs and LAN-on Motherboard (LOM)
ISCSI 1.0 / iSER Host Bus Adapters (HBA)
RDMA Network Interface Card (RNIC)
Network Interface Cards (NIC) designs
10/100/1000
PCI 2.3 Adapters
LAN on Motherboard (LOM) designs
10/100/1000
PCI 2.3 LOM
BASE-T
1000
BASE-SX
1000
BASE-LX
PCI-X v1.0 Adapters
PCI 2.3 Adapters
PCI-X v1.0 Adapters
PCI 2.3 Adapters
PCI-X v1.0 Adapters
BASE-T
1000
BASE-SX
1000
BASE-LX
PCI-X v1.0 LOM
PCI 2.3 LOM
PCI-X v1.0 LOM
PCI 2.3 LOMPCI
PCI-X v1.0 LOM
Broadcom
®
, the pulse logo, and
Connecting everything
®
are trademarks of Broadcom Corporation and/
or its subsidiaries in the United States and certain other countries. All other trademarks mentioned are the
property of their respective owners.
®
BROADCOM CORPORATION
16215 Alton Parkway, P.O. Box 57013
Irvine, California 92619-7013
© 2004 by BROADCOM CORPORATION. All rights reserved.
5706-PB04-R
03/31/04
Phone: 949-450-8700
Fax: 949-450-8710
E-mail: info@broadcom.com
Web: www.broadcom.com

BCM5706 Related Products

BCM5706
Description Telecom Circuit, 1-Func, CMOS, PBGA400, 21 X 21 MM, TFBGA-400
Maker QLogic Corporation
package instruction BGA,
Reach Compliance Code unknown
JESD-30 code S-PBGA-B400
Humidity sensitivity level 1
Number of functions 1
Number of terminals 400
Package body material PLASTIC/EPOXY
encapsulated code BGA
Package shape SQUARE
Package form GRID ARRAY
Peak Reflow Temperature (Celsius) 225
Certification status Not Qualified
surface mount YES
technology CMOS
Telecom integrated circuit types TELECOM CIRCUIT
Terminal form BALL
Terminal location BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED

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