EEWORLDEEWORLDEEWORLD

Part Number

Search

2036-09SM-RP

Description
TELECOM, SURGE PROTECTION CIRCUIT, XSS
CategoryWireless rf/communication    Telecom circuit   
File Size251KB,3 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Download Datasheet Parametric View All

2036-09SM-RP Overview

TELECOM, SURGE PROTECTION CIRCUIT, XSS

2036-09SM-RP Parametric

Parameter NameAttribute value
package instruction,
Reach Compliance Codeunknow
JESD-30 codeX-XXSS-X
Number of functions1
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
Package body materialUNSPECIFIED
Package shapeUNSPECIFIED
Package formSPECIAL SHAPE
Certification statusNot Qualified
surface mountNO
Telecom integrated circuit typesSURGE PROTECTION CIRCUIT
Temperature levelOTHER
Terminal formUNSPECIFIED
Terminal locationUNSPECIFIED
Base Number Matches1
*R
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
Balanced Mini-TRIGARD™ Series
High surge current rating, low insertion loss
(5 mm diameter, 7.3 mm length)
Ideal for board level protection of
broadband circuits
Leadless, surface mount for economical
assembly
Stable breakdown throughout life
UL Recognized
RoHS compliant* version available
2036-xx-SM Precision Gas Discharge Tube Surge Protector
Bourns now offers a surface mount (SM) 3-electrode Gas Discharge Tube (GDT) surge protection device. The industry-leading quality
and features of the Bourns
®
miniature 2036 TRIGARD™ series GDT continues in this new SM version for “pick and place”
manufacturing techniques. The 2036 SM device is ideal for board level protection of high bandwidth applications such as xDSL,
cable broadband and high speed Ethernet, due to its high energy handling capability, long and stable life performance and low
capacitance of less than 2 pF. Bourns subminiature family of GDTs measure only 5 mm in diameter and are the smallest high
performance GDTs in the telecom industry. Bourns
®
GDTs are designed to prevent damage from transient disturbances by acting as
a “crowbar” in creating a short-to-ground circuit during conduction. When a voltage transient surge exceeds the defined breakdown
voltage level of the GDT, the device becomes ionized and conduction takes place within a fraction of a microsecond. When the surge
passes and system voltage returns to normal levels, the GDT returns to its high-impedance (off) state.
Characteristics
Test Methods per ITU-T (CCITT) K.12, IEEE C62.31
Characteristic
DC Sparkover ±20 % @ 100 V/s
Impulse Sparkover
100 V/µs
1000 V/µs
Characteristic
DC Sparkover ±20 % @ 100 V/s
Impulse Sparkover
100 V/µs
1000 V/µs
2036-07
75 V
250 V
525 V
2036-30
300 V
500 V
650 V
2036-09
90 V
250 V
550 V
2036-35
350 V
600 V
750 V
Model No.
2036-15
2036-20
150 V
200 V
350 V
500 V
425 V
575 V
2036-23
230 V
450 V
600 V
2036-47
470 V
750 V
950 V
2036-25
250 V
475 V
625 V
2036-60
600 V
850 V
1100 V
Model No.
2036-40
2036-42
400 V
420 V
650 V
825 V
675 V
850 V
75 ns
10
10
Ω
70 V
10 V
0.5 A
2 pF
150 ms
Impulse Transverse Delay................................ 100 V/μs............................................................<
Insulation Resistance (IR) ................................ 100 V (50 V for Model 2036-07 & 2036-09) ......>
Glow Voltage ................................................... 10 mA................................................................~
Arc Voltage ...................................................... 1 A.....................................................................~
Glow-Arc Transition Current .......................................................................................................<
Capacitance .................................................... 1 MHz ...............................................................<
DC Holdover Voltage
1
.................................... >135 V, (52 V for Model 2036-07, & -09, ..........<
......................................................................... 80 V for Model 2036-15)
Impulse Discharge Current .............................. 20000 A, 8/20 µs
2
.............................................
10000 A, 8/20 µs...............................................>
200 A, 10/1000 µs ............................................>
2000 A, 10/350 µs.............................................
200 A, 10/700 µs ..............................................>
Alternating Discharge Current ......................... 20 Arms, 1 s
2
....................................................
10 Arms, 1 s ......................................................>
Operating Temperature...............................................................................................................
Climatic Category (IEC 60068-1) ................................................................................................
1 operation minimum
10 operations
300 operations
1 operation
500 operations
1 operation minimum
10 operations
-55 to +85 °C
40/90/21
Notes:
• UL Recognized component, UL File E153537.
• No model number marking on tube; date code and voltage only: month year digits, xxxV (e.g. 0209 400V).
• The rated discharge current for Mini-TRIGARD™ GDTs is the total current equally divided between each line to ground.
• Surface Mount (SM) parts may show a temporary increase in DCBD after the solder reflow process. Most devices will recover
within 24 hours time. It should be noted that there is no quality defect nor change in protection levels during the temporary
change in DCBD.
• Sparkover limits after life ±25 % (-25 %,+30 % for Model 2036-07, 2036-09 and 2036-60), IR >10
8
Ω.
• Operating characteristics per RUS PE-80 and Telcordia GR 1361 available on request.
• Line to Line voltage is approximately 1.8 to 2 times the stated Line to Ground breakdown voltage.
• At delivery AQL 0.65 Level II, DIN ISO 2859.
1
Network applied.
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Altera-SoCFPGA-HardwareLib-SPI-RW-CV-ARMCC
Altera-SoCFPGA-HardwareLib-SPI-RW-CV-ARMCC....
雷北城 FPGA/CPLD
Learn Analog + "Operational Amplifier Noise Optimization Handbook" 1/f Noise Notes
[i=s]This post was last edited by dontium on 2015-1-23 11:32[/i]1/f noise The 1/f noise of an operational amplifier is also called flicker noise. Using a slow scan on an oscilloscope to observe 1/f no...
lonerzf Analogue and Mixed Signal
Network intelligent system, --- human-computer dialogue
First open http://blog.sina.com.cn/u/1257739603 and click on the friendly link: Network intelligent system, human-computer dialogue. This is an intelligent system developed in California, USA....
jgiuol Talking
Why Sub-1GHz is used in IoT applications
The Internet of Things (IoT) market continues to grow rapidly, with more and more devices connecting to the cloud. Applications such as home automation enable your installed lighting, heating and alar...
maylove Wireless Connectivity
About the copyright issues of fonts used in Wince
My program needs to use bold fonts in Wince, but there is no bold font in Wince. I need to copy a copy from Windows. Does this involve the copyright of the fonts? How can I solve it? Thank you~...
ajie1987 Embedded System
Low power signal transmission
[i=s]This post was last edited by paulhyde on 2014-9-15 09:20[/i] Low Power Signal Transmitter...
朱110800311 Electronics Design Contest

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1902  240  158  2360  1503  39  5  4  48  31 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号