BURNDY
LIF PGA Series
Description
Applications
PGA socket for all purposes
in electronic area
• This highly accommodating socket is
designed with many valuable features. It is
constructed of high temperature, glass-filled
Thermoplastic so it will withstand both I.R.
and vapor phase solder reflow temperatures
and it has a UL rating of 94-VO.
• To provide low insertion force with high
normal force characteristics this socket is
designed with. 012” (0,3) staggered contact
configuration. A typical 169 position seating
force is less than 40 pounds.
• To accommodate Intel based microproces-
sors the sockets are available in 168, 169,
208, 237, 238 and 273 positions.
• The socket’s industry-standard housing
configuration includes convenient installation
features :
- it occupies the same PCB area as the
Microprocessor
- installed socket height equals .280” (7.1)
maximum which allows .500” (12.7) of
spacing between PCBs
- a 75° conical lead-in assures superior micro-
processor pin guidance.
- the preloaded phosphor bronze contact
accepts .016 - .020” (0.41 - 0.51) diameter pins
- 60° tapered solder tail facilitates a smooth
entry into the PCB
- .120” (3.0) solder tail length accommodates
industry standard .0625” (1.59) thick PCBs
- the socket enlists dual beam contact
geometry by providing two large gold plated
surfaces for maximum contact wipe
• The #1 pin locator is provided by a 45° outer
polarization chamfer while the 45° inner
polarization chamfer makes the socket
compatible with robotic assembly. Burndy tube
packaging also contributes to automatic
handling while providing superior pin protection.
• The socket’s dimensions provide for optimal
microprocessor operation :
- .047” (1.19) Microprocessor standoffs and
the open bottom housing permit improved
air flow and cooling of microprocessors
- .032” (0.81) PCB standoff ensures proper
solder joint inspection along with easy
repairs and cleaning.
Standards
Characteristics
Electrical
• Voltage Rating :
28 VAC at .5 amps max
• Current Rating :
2 ampere with 30° rise over ambient
• Contact Resistance :
- Initial
10 milliohms max
- Post Test
20 milliohms max
• Capacitance :
2.0 pf max at 10 MgHz
Finish
• Contact Plating :
- Underplate :
50 microinches (1.27 microns) min nickel
- Mating area variations :
15 microinches (0.38 microns) min gold
10 microinches (0.25 microns) min
palladium/nickel with gold flash
25 microinches (0.63 microns) min
palladium/nickel with gold flash
(see plating type designation below)
- Solder Tail Area :
100 microinches (2.54 microns) min tin/lead
Material
• Housing :
- Glass filled,
High Temperature Thermoplastic
- UL Rating : UL94-VO
- Color : Black
• Contacts : Copper Alloy
Environmental
• Operating Temperature :
-40°F (-40°C) to +203°F (+95°C)
Mechanical
• Durability : 25 cycles
• Insertion Force :
3.0 oz (0.83N) Max Avg (.020 (0.51) Dia Pin)
• Extraction Force :
0.53 oz (0.15N) Min Avg (.020 (0.51) Dia Pin)
Ordering information
PGA socket
N. of contacts positions
housing size
solder tail lenght
design variations
plating type
A -
15 microinches (0.38 microns) min gold,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
E
-
10 microinches (0.25 microns) min palladium/nickel with gold flash,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
F
-
25 microinches (0.63 microns) min palladium/nickel with gold flash,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
- 168, 169, 208, 237, 238, 273
-
N-R-T (see page 511)
W =
.12 (3.0)
PG
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1
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510
stm32/stm8
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