MCIMX25 datasheet, PDF - EEWORLD Datasheet

Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX25AEC

Rev. 8, 01/2011

i.MX25 Applications

Processor for Automotive

Products

Silicon Version 1.2

MCIMX25

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

1

Introduction

Ordering Information

See

Table 1 on page 3

for ordering information.

The i.MX25 family of processors offers integration

that tailors itself to the connectivity requirements of

today's automobile infotainment systems. These

processors have been architected to meet auto

infotainment requirements like CAN, USB

connectivity, and audio connectivity, without many

of the extra features only needed for high-end

applications. As a result, the i.MX25 enables many

of the features only available in high-end systems,

but at a price point suitable for all vehicles.

At the core of the i.MX25 is Freescale's fast,

proven, power-efficient implementation of the

ARM926EJ-S core, with speeds of up to 400 MHz.

The i.MX25 includes support for up to 133-MHz

DDR2 memory, integrated 10/100 Ethernet MAC,

and two on-chip USB PHYs. The automotive

versions of the i.MX25 offer AEC-Q100 grade 3

qualification to meet stringent automotive quality

requirements. The device is suitable for a wide

range of applications, including the following:

• USB Connectivity for media

storage/playback, personal media device

interface, and firmware updates

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9

3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11

3.2. Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18

3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19

3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20

3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 25

3.7. Module Timing and Electrical Parameters . . . . . . 42

4. Package Information and Contact Assignment . . . . . . 124

4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124

4.2. Ground, Power, Sense, and Reference Contact

Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125

4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm

Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135

5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

•

Bluetooth™ connectivity for hands free phone calling and streaming audio from wireless devices

like phones or PND

Control of the infotainment system through basic speech recognition or touch screen

Smart toll and metering applications

Secure data black box applications

Features of the i.MX25 processor include the following:

• Advanced power management—The heart of the device is a level of power management

throughout the IC that enables the multimedia features and peripherals to achieve minimum system

power consumption in active and various low-power modes. Power management techniques allow

the designer to deliver a feature-rich product that requires levels of power far lower than typical

industry expectations.

• Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a

16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with

alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen

controller), and a programmable Smart DMA (SDMA) controller.

• 128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for

eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows

the designer to enable an ultra low power LCD refresh.

• Interface flexibility—The device interface supports connection to all common types of external

memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,

and managed NAND.

• Increased security—Because the need for advanced security for tethered and untethered devices

continues to increase, the i.MX25 processor delivers hardware-enabled security features that

enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust

tamper detection, secure boot, and secure software downloads.

• On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.

• Fast Ethernet—For rapid external communication, a Fast Ethernet Controller (FEC) is included.

• i.MX25 only supports Little Endian mode.

i.MX25 Applications Processor for Automotive Products, Rev. 8

2

Freescale Semiconductor

1.1

Ordering Information

Table 1. Ordering Information

1

Table 1

provides ordering information for the i.MX25.

Description

i.MX251

i.MX255

i.MX251

i.MX255

i.MX251

i.MX255

1

Part Number

MCIMX251AVM4!

MCIMX255AVM4!

MCIMX251AJM4

MCIMX255AJM4

MCIMX251AJM4A

MCIMX255AJM4A

Silicon

Version

1.1

1.2

Projected

Temperature

Range (°C)

–40 to +85

Package

17 x 17 mm, 0.8 mm pitch,

MAPBGA-400

17 x 17 mm, 0.8 mm pitch,

MAPBGA-400

17 x 17 mm, 0.8 mm pitch,

MAPBGA-400

17 x 17 mm, 0.8 mm pitch,

MAPBGA-400

17 x 17 mm, 0.8 mm pitch,

MAPBGA-400

17 x 17 mm, 0.8 mm pitch,

MAPBGA-400

Ballmap

Table 103

Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers

indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:

Indicated by the Icon (!)

Table 2

shows the functional differences between the different parts in the i.MX25 family.

Table 2. i.MX25 Parts Functional Differences

Features

Core

CPU Speed

L1 I/D Cache

On-chip SRAM

PATA/CE-ATA

LCD Controller

Touchscreen

CSI

FlexCAN (2)

ESAI

SIM (2)

Security

10/100 Ethernet

HS USB 2.0 OTG + PHY

HS USB 2.0 Host + PHY

MCIMX251

ARM926EJ-S™

400 MHz

16K I/D

128 KB

—

Yes

MCIMX255

ARM926EJ-S™

400MHz

16K I/D

128 KB

Yes

i.MX25 Applications Processor for Automotive Products, Rev. 8

Freescale Semiconductor

3

Table 2. i.MX25 Parts Functional Differences (continued)

Features

12-bit ADC

SD/SDIO/MMC (2)

External Memory Controller

I

2

C (3)

SSI/I2S (2)

CSPI (2)

UART (5)

MCIMX251

Yes

MCIMX255

Yes

i.MX25 Applications Processor for Automotive Products, Rev. 8

4

Freescale Semiconductor

1.2

Block Diagram

DDR2 /

MDDR

NOR

Flash/

PSRAM

NAND

Flash

Ext. Graphics

Accelerator

Camera

Sensor

LCD Display 1

Figure 1

shows the simplified interface block diagram.

ARM® Processor Domain (AP)

External Memory

Interface (EMI)

CSI

LCDC /

SLCDC

Smart

DMA

ARM9

Platform

ARM926EJ-S

L1 I/D cache

ARM Peripherals

SSI

AUDMUX

I C(3)

2

HS USBOTG

HS USB OT GPHY

Shared

Domain

SPBA

HS USB Host

FS USB Host PHY

SDMA Peripherals

AVIC

MAX

AIPS (2)

ETM

UART(2)

CSPI

eSDHC(2)

FlexCAN(2)

ECT

IOMUX

IIM

RTICv3

RNGB

SCC

DRYICE

KPP

PWM(4)

Timers

RTC

WDOG

GPT(4)

GPIO(3)

EPIT(2)

SSI(1)

ESAI

UART(3)

CSPI(2)

ADC/TSC

SIM(2)

ATA

FEC

Internal

Memory

Fusebox

1-WIRE

Audio/Power

Management

JTAG

Bluetooth

MMC/SDIO

or WLAN

Keypad

Access.

Conn.

Figure 1. i.MX25 Simplified Interface Block Diagram

i.MX25 Applications Processor for Automotive Products, Rev. 8

Freescale Semiconductor

5

MCIMX25

MCIMX25 Overview

Preview

MCIMX25 Related Products

Recommended Resources