EEWORLDEEWORLDEEWORLD

Part Number

Search

P0402FC12C-T710-1

Description
Trans Voltage Suppressor Diode, 250W, 12V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4
CategoryDiscrete semiconductor    diode   
File Size803KB,9 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
Download Datasheet Parametric View All

P0402FC12C-T710-1 Overview

Trans Voltage Suppressor Diode, 250W, 12V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4

P0402FC12C-T710-1 Parametric

Parameter NameAttribute value
MakerProTek Devices
Parts packaging codeFLIP-CHIP
package instructionR-PBGA-B4
Contacts4
Reach Compliance Codecompliant
ECCN codeEAR99
Minimum breakdown voltage13.3 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PBGA-B4
Maximum non-repetitive peak reverse power dissipation250 W
Number of components1
Number of terminals4
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formGRID ARRAY
polarityBIDIRECTIONAL
Maximum repetitive peak reverse voltage12 V
surface mountYES
technologyAVALANCHE
Terminal formBALL
Terminal locationBOTTOM
05107
Only One Name Means ProTek’Tion™
P0402FC3.3C - P0402FC36C
250w FliP ChiP tvs aRRay
DesCRiPtion
The P0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level
transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed
specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These
devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per
line for an 8/20µs waveform. In addition, the P0402FCxxC series features superior clamping performance, low leak-
age current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates
overshoot voltage due to package inductance.
0402 PaCkage
FeatuRes
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Protection for 1 Line
RoHS Compliant
REACH Compliant
aPPliCations
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
MeChaniCal ChaRaCteRistiCs
Standard EIA Chip Size: 0402
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
CiRCuit DiagRaM
Pin 1
Pin 2
1 line of Protection
05107.R12 8/10
Page 1
www.protekdevices.com

Recommended Resources

Dynamic Power Management Technology for Embedded Systems
Dynamic Power Management Technology for Embedded Systems Author: Raymond Liu Please indicate the source for reprinting Email: [email]colorant@163.com[/email] BLOG: [url]http://blog.csdn.net/colorant/[...
绿茶 Embedded System
mplayer installation process and supplements
When we installed mplayer before, we often referred to online tutorials, but some tutorials only focused on the operating environment of the local machine and could be installed normally. But on begin...
swz Embedded System
About MSP430FR5739
Haha, I have been tinkering with ARM and 8-bit MCU, and have never paid much attention to the MSP430 series MCU. But recently it’s different. I want to develop a handheld instrument! This brings a new...
dengxiaofeng Microcontroller MCU
FPGA board ARM board SOC board part-time
I have been working for more than 10 years and have been engaged in FPGA board, ARM board, altera SOC board development for a long time, including making schematics and writing codes, providing win7 w...
tomdong074 Recruitment
Also talk about the classification and name of Texas Instruments DSP core
Since TI launched the revolutionary new architecture - TMS320C665x series, it features multi-core DSP, combining high performance with low power consumption in the smallest package. In fact, TI DSP ha...
qwqwqw2088 DSP and ARM Processors
Insights on Faster, Better Wi-Fi Deployment in Asia
As Wi-Fi standards expand spectrum and range around the world, countries face different challenges and take different approaches to rollout. Join Jeff Lin as he explores deployment strategies in Asia....
兰博 RF/Wirelessly

Popular Articles

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2501  1764  1252  956  184  51  36  26  20  4 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号