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KS664-85TT

Description
IC Socket, DIP64, 64 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder,
CategoryThe connector    socket   
File Size255KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

KS664-85TT Overview

IC Socket, DIP64, 64 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder,

KS664-85TT Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresSOCKET ADAPTER
body width0.7 inch
subject depth0.03 inch
body length3.2 inch
Contact to complete cooperationTIN LEAD OVER NICKEL
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBERYLLIUM COPPER/COPPER ALLOY
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedDIP64
Shell materialPOLYIMIDE
JESD-609 codee0
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts64
Maximum operating temperature400 °C
Minimum operating temperature-269 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.6 mm
Terminal pitch2.54 mm
Termination typeSOLDER
DIP Sockets
Table of Models
Peel-A-Way DIP Socket Terminal Carriers
Description:
Peel-A-Way
®
Socket (KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005
(.13)
Polyimide
Film
For molded insulators, see pages 28-29.
Options
• Removable tape seal protects plated contact in harsh environments
Tape Seal - add 3M to end of part number
Features:
• Peel away terminal carrier after
soldering.
• Disposable carrier.
• Complete soldering visibility on
both sides of PCB.
• Maximum air flow.
• Better flux rinse.
• No contact damage due to
terminal carrier insertion.
• No contact pull out due to
extraction of terminal carrier.
(shown here on
molded socket)
• Spray flux without contaminating contact area
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Material
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
See pg. 29 for intrusive reflow application.
Tin/Lead: Type -111
Lead-free: Type -810
Peel-A-Way
®
only
.058 Dia.
(1.47)
Tin/Lead: Type -151
Lead-free: Type -812
.072 Dia.
(1.83)
.130
(3.30)
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.031
(.79)
.155
(3.94)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.038 Dia.
(.97)
How To Order
KS
Body Type
RoHS Compliant Insulators:
3
16
- 85
M
G
Contact Plating
RoHS Compliant:
KS - Peel-A-Way
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)
Number of Pins
(8 to 64)
Additional sizes available - consult factory.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
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