DIP POWER CHOKE COIL
1. PART NO. EXPRESSION :
SDM129HLA SERIES
SDM129HLA-1R0MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : 1R0 = 1.00uH
(d) Tolerance code : M = ±20%
(e) F : RoHS Compliant
2. CONFIGURATION & DIMENSIONS :
A
F
B
E
F
L
12.5
E
L
R32e
YY.WW
H
C
G
12.5
PCB Pattern
ØW
D
Unit:m/m
B
C
D
3.4±0.5
3.4±0.5
3.4±0.5
3.4±0.5
E
6.0±0.5
6.0±0.5
6.0±0.5
6.0±0.5
F
7.3±0.5
7.3±0.5
7.3±0.5
7.3±0.5
ØW
1.6±0.1
1.6±0.1
1.5±0.1
1.4±0.1
L
9.5±0.5
9.5±0.5
9.5±0.5
9.5±0.5
G
0.5±0.2
0.5±0.2
0.5±0.2
0.5±0.2
H
1.9 Typ.
1.9 Typ.
1.8 Typ.
1.7 Typ.
Series
SDM129HLA-R32MF
SDM129HLA-R50MF
SDM129HLA-R68MF
SDM129HLA-1R0MF
A
12.5 Max.
12.5 Max. 10.5 Max.
12.5 Max. 12.5 Max. 10.5 Max.
12.5 Max.
12.5 Max.
12.5 Max. 10.5 Max.
12.5 Max. 10.5 Max.
3. SCHEMATIC :
4. MATERIALS :
(a) Core : e Iron Core
(b) Wire : Enamelled Copper Wire
(c) Solder : Sn99.95%-Cu0.05%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.03.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
DIP POWER CHOKE COIL
5. GENERAL SPECIFICATION :
a) Test Frequency : 100KHz/1.0V
b) Operating temp. : -25°C to +125°C
c) Ambient temp. : 20°C
d) Irms (A) : Will cause an approximately temp. rise
∆T
< 40°C
e) Isat (A) : Will cause L
0
to drop approximately 20%
SDM129HLA SERIES
f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions.
6. ELECTRICAL CHARACTERISTICS :
Part No.
SDM129HLA-R32MF
SDM129HLA-R50MF
SDM129HLA-R68MF
SDM129HLA-1R0MF
Inductance L
0
( uH )
±20% @ 0Adc
0.32
0.50
0.68
1.00
Irms
(A)
Max.
40
32
30
25
Isat
(A)
Max.
55
50
40
35
DCR
( mΩ )
±8%
0.30
0.50
0.55
0.85
Q
Min.
30
30
40
40
7. CHARACTERISTICS CURVES :
0 .5
SDM129HLA-R32MF
DMPI129HLA-R32M
80
1
SDM129HLA-R50MF
DM PI129HLA-R50M
80
70
70
0 .4
INDUCTANCE (uH)
INDUCTANCE (uH)
60
0.75
60
50
TEMP. RISE(
o
C)
0 .3
50
40
0 .5
40
30
0 .2
30
20
0.25
20
10
0 .1
10
0
0
0
0
0
11
22
33
44
55
0
10
20
30
40
50
DC CURRENT(A)
DC CURRENT(A)
SDM129HLA-1R0MF
DMPI129HLA-1R0M
1 .2
SDM129HLA-R68MF
DMPI129HLA -R68M
80
70
2
80
70
INDUCTANCE (uH)
INDUCTANCE (uH)
0 .9
60
1 .5
60
50
50
TEMP. RISE(
o
C)
0 .6
40
30
1
40
30
0 .3
20
10
0 .5
20
10
0
0
0
0
0
10
20
30
40
0
7
14
21
28
35
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.03.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
TEMP. RISE(
o
C)
TEMP. RISE(
o
C)
DIP POWER CHOKE COIL
7. CHARACTERISTICS CURVES :
SDM129HLA Series
DMPI129HLA-Series-Z01
SDM129HLA SERIES
INDUCTANCE(uH)
FREQUENCY(M Hz)
Inductance
(uH)
Frequency ( MHz )
0.001 0.05
0.28
0.50
0.69
1.01
0.32
0.53
0.71
1.03
0.1
0.32
0.52
0.71
1.03
0.3
0.31
0.52
0.71
1.03
0.5
0.31
0.52
0.71
1.03
0.8
0.31
0.52
0.71
1.02
1.0
0.31
0.51
0.70
1.02
2.0
0.28
0.49
0.67
0.99
3.0
0.30
0.51
0.69
1.00
4.0
0.28
0.48
0.66
0.98
5.0
0.27
0.48
0.60
0.97
6.0
0.27
0.47
0.65
0.97
7.0
0.27
0.47
0.65
0.96
8.0
0.27
0.47
0.64
0.95
9.0
0.26
0.46
0.64
0.95
10
0.26
0.46
0.63
0.95
SDM129HLA-R32MF
SDM129HLA-R50MF
SDM129HLA-R68MF
SDM129HLA-1R0MF
SDM129HLA Series
DMPI129HLA-Series-Z01
Q
FREQUENCY(M Hz)
Inductance
(uH)
Frequency ( MHz )
0.001 0.05
0.98
0.95
1.78
3.06
42.8
35.8
60.1
75.2
0.1
60.8
51.9
79.4
91.7
0.3
69.4
63.5
79.3
80.5
0.5
59.8
57.0
60.6
62.7
0.8
45.1
44.8
43.8
45.6
1.0
41.6
40.8
38.2
38.9
2.0
21.3
22.6
20.2
20.1
3.0
15.4
16.1
14.2
14.3
4.0
11.3
12.2
10.8
10.9
5.0
9.28
10.0
8.84
8.99
6.0
7.94
8.61
7.56
7.70
7.0
6.99
7.57
5.94
6.76
8.0
6.27
6.80
5.39
6.04
9.0
5.71
6.19
5.40
5.48
10
5.27
5.70
4.95
5.02
SDM129HLA-R32MF
SDM129HLA-R50MF
SDM129HLA-R68MF
SDM129HLA-1R0MF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.03.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
DIP POWER CHOKE COIL
8. RELIABILITY AND TEST CONDITION :
SDM129HLA SERIES
ITEM
Electrical Characteristics Test
Inductance
DCR
Heat Rated Current (Irms)
Saturation Current (Isat)
Mechanical Performance Test
Solderability Test
PERFORMANCE
Refer to standard electrical characteristics list
TEST CONDITION
HP4284A or CH3302/1320/1320S
HIOKI3540
Irms(A) will cause an temp rise < 40°C typ.
Isat(A) will cause Lo to drop approximately 20%
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
Natural
cooling
150°C
60
seconds
4±1
seconds
After fluxing, component shall be dipped in a melted
solder bath at 245±5°C for 5 seconds
Solder Heat Resistance
1. Appearance : No significant abnormality
2. Inductance change : Within ±10% of initial value
Preheat : 150°C, 60sec.
Solder : lead free
Solder Temperature : 260±5°C
Flux : rosin
260°C
Dip Time : 10±0.5sec.
150°C
Preheating
Dipping
Natural
cooling
60
seconds
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Temperature : 85±5°C
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
1. Appearance : No damage
2. Inductance : Within ±10% of initial value.
Thermal Shock
No disconnection or short circuit.
Temperature : -20±5°C
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Conditions of 1 cycle.
Step
1
2
3
4
Temperature (°C)
-25±3
Room Temperature
125±3
Room Temperature
Times (min.)
30±3
Within 3
30±3
Within 3
Low Temperature
Life Test
Total : 5 cycles
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±10% of initial value.
No disconnection or short circuit.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Current
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions and times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Random Vibration Test
Appearance : Cracking, chipping and any other
defects harmful to the characteristics should not
be allowed.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.03.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
DIP POWER CHOKE COIL
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
SDM129HLA SERIES
Unit:m/m
F
L
Series
SDM129HLA-R32MF
E
6.0±0.5
6.0±0.5
6.0±0.5
6.0±0.5
F
7.3±0.5
7.3±0.5
7.3±0.5
7.3±0.5
L
9.5±0.5
9.5±0.5
9.5±0.5
9.5±0.5
H
1.9 Typ.
1.9 Typ.
1.8 Typ.
1.7 Typ.
12.0
E
SDM129HLA-R50MF
H
SDM129HLA-R68MF
SDM129HLA-1R0MF
12.0
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
TEMPERATURE °C
Soldering
TEMPERATURE °C
20~40s max.
TP(260°C/10s max.)
217
200
150
60~180s
480s max.
60~150s
Natural
cooling
Preheating
350
300
150
Soldering
Natural
cooling
TIME(sec.)
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.03.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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