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EPF10K250EGC599-2

Description
Loadable PLD, CMOS, CPGA599, HEAT SINK, PGA-599
CategoryProgrammable logic devices    Programmable logic   
File Size2MB,63 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric View All

EPF10K250EGC599-2 Overview

Loadable PLD, CMOS, CPGA599, HEAT SINK, PGA-599

EPF10K250EGC599-2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
package instructionHIPGA, SPGA599,47X47
Reach Compliance Codecompliant
JESD-30 codeS-CPGA-P599
JESD-609 codee0
length62.484 mm
Humidity sensitivity level1
Dedicated input times4
Number of I/O lines470
Number of entries470
Number of logical units12160
Output times470
Number of terminals599
Maximum operating temperature70 °C
Minimum operating temperature
organize4 DEDICATED INPUTS, 470 I/O
Output functionMIXED
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeHIPGA
Encapsulate equivalent codeSPGA599,47X47
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
Peak Reflow Temperature (Celsius)220
power supply2.5,2.5/3.3 V
Programmable logic typeLOADABLE PLD
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage2.7 V
Minimum supply voltage2.3 V
Nominal supply voltage2.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width62.484 mm
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