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CMLM0305GBKLEADFREE

Description
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET
CategoryDiscrete semiconductor    The transistor   
File Size586KB,2 Pages
ManufacturerCentral Semiconductor
Environmental Compliance
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CMLM0305GBKLEADFREE Overview

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

CMLM0305GBKLEADFREE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCentral Semiconductor
package instruction,
Reach Compliance Codecompliant
ConfigurationSingle
Maximum drain current (Abs) (ID)0.28 A
FET technologyMETAL-OXIDE SEMICONDUCTOR
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.35 W
surface mountYES
CMLM0305
CMLM0305G*
Multi Discrete Module
SURFACE MOUNT
N-CHANNEL MOSFET AND
LOW VF SILICON SCHOTTKY DIODE
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMLM0305 and
CMLM0305G are Multi Discrete Modules™ consisting
of a single N-Channel Enhancement-mode MOSFET
and a Low VF Schottky diode packaged in a space
saving PICOmini™ SOT-563 surface mount case. This
device is designed for small signal general purpose
applications where size and operational efficiency are
prime requirements.
MARKING CODES: CMLM0305:
5C3
CMLM0305G*: 5CG
SOT-563 CASE
*
Device is
Halogen Free
by design
FEATURES:
• ESD protection up to 2kV
• Low rDS(on) Transistor (3Ω MAX @ VGS=1.8V)
• Low VF Schottky Diode (0.47V MAX @ 0.5A)
SYMBOL
PD
PD
PD
TJ, Tstg
Θ
JA
SYMBOL
VDS
VDG
VGS
ID
IDM
SYMBOL
VRRM
IF
IFRM
IFSM
350
300
150
-65 to +150
357
UNITS
mW
mW
mW
°C
°C/W
UNITS
V
V
V
mA
A
UNITS
V
mA
A
A
APPLICATIONS:
• DC / DC Converters
• Battery Powered Portable Equipment
MAXIMUM RATINGS - CASE:
(TA=25°C)
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Power Dissipation (Note 3)
Operating and Storage Junction Temperature
Thermal Resistance
MAXIMUM RATINGS - Q1:
(TA=25°C)
Drain-Source Voltage
Drain-Gate Voltage
Gate-Source Voltage
Continuous Drain Current
Maximum Pulsed Drain Current
MAXIMUM RATINGS - D1:
(TA=25°C)
Peak Repetitive Reverse Voltage
Continuous Forward Current
Peak Repetitive Forward Current, tp≤1.0ms
Peak Forward Surge Current, tp= 8.0ms
50
50
12
280
1.5
40
500
3.5
10
ELECTRICAL CHARACTERISTICS - Q1:
(TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
MAX
IGSSF, IGSSR
VGS=5.0V
100
IGSSF, IGSSR
VGS=10V
2.0
IGSSF, IGSSR
VGS=12V
2.0
VDS=50V, VGS=0
50
IDSS
50
BVDSS
VGS=0, ID=10μA
VGS(th)
VDS=VGS, ID=250μA
0.49
1.0
Notes:
(1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm
2
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm
2
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm
2
UNITS
nA
μA
μA
nA
V
V
R3 (18-January 2010)

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Description Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HALOGEN FREE, PICOMINI-6 Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HALOGEN FREE, PICOMINI-6 Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HALOGEN FREE, PICOMINI-6 Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HALOGEN FREE, PICOMINI-6
Is it Rohs certified? conform to conform to incompatible incompatible conform to incompatible incompatible
package instruction , , SMALL OUTLINE, R-PDSO-F6 SMALL OUTLINE, R-PDSO-F6 , SMALL OUTLINE, R-PDSO-F6 HALOGEN FREE, PICOMINI-6
Reach Compliance Code compliant compliant not_compliant not_compliant compliant not_compliant unknown
Configuration Single Single SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE Single SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Maximum drain current (Abs) (ID) 0.28 A 0.28 A 0.28 A 0.28 A 0.28 A 0.28 A 0.28 A
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 0.35 W 0.35 W 0.35 W 0.35 W 0.35 W 0.35 W 0.35 W
surface mount YES YES YES YES YES YES YES
Maker Central Semiconductor - - - Central Semiconductor Central Semiconductor Central Semiconductor
JESD-609 code - e3 e0 e0 - e0 e3
Terminal surface - Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) MATTE TIN
Contacts - - 6 6 - 6 6
ECCN code - - EAR99 EAR99 - EAR99 EAR99
Minimum drain-source breakdown voltage - - 50 V 50 V - 50 V 50 V
Maximum drain current (ID) - - 0.28 A 0.28 A - 0.28 A 0.28 A
Maximum drain-source on-resistance - - 3 Ω 3 Ω - 3 Ω 3 Ω
Maximum feedback capacitance (Crss) - - 5 pF 5 pF - 5 pF 5 pF
JESD-30 code - - R-PDSO-F6 R-PDSO-F6 - R-PDSO-F6 R-PDSO-F6
Number of components - - 1 1 - 1 1
Number of terminals - - 6 6 - 6 6
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
Package shape - - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form - - SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE
Certification status - - Not Qualified Not Qualified - Not Qualified Not Qualified
Terminal form - - FLAT FLAT - FLAT FLAT
Terminal location - - DUAL DUAL - DUAL DUAL
transistor applications - - SWITCHING SWITCHING - SWITCHING SWITCHING
Transistor component materials - - SILICON SILICON - SILICON SILICON

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