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LJTIH-15-37PC

Description
MIL Series Connector, 37 Contact(s), Carbon Steel, Male, Solder Terminal, Receptacle
CategoryThe connector    The connector   
File Size422KB,1 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Download Datasheet Parametric View All

LJTIH-15-37PC Overview

MIL Series Connector, 37 Contact(s), Carbon Steel, Male, Solder Terminal, Receptacle

LJTIH-15-37PC Parametric

Parameter NameAttribute value
MakerAmphenol
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresSTANDARD: MIL-C-27599, POLARIZED
Back shell typeSOLID
Body/casing typeRECEPTACLE
Connector typeMIL SERIES CONNECTOR
Contact to complete cooperationTIN
Contact completed and terminatedTIN
Contact point genderMALE
Coupling typeBAYONET
DIN complianceNO
empty shellNO
Filter functionNO
IEC complianceNO
JESD-609 codee3
MIL complianceYES
Manufacturer's serial numberLJT
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
OptionsHERMETIC
Shell surfaceTIN
Shell materialCARBON STEEL
Housing size15
Termination typeSOLDER
Total number of contacts37
LJTI (MS27471) — hermetic
solder mounting receptacle
L
+.006
–.005
M
+.030
.031
.304
–.040
N
KK
SS
GG
* LJTIH-XX-XXX
** LJTIY-XX-XXX (MS27471YXXD)
*** LJTSIY-XX-XXX (MS27471YXXE)
* To complete order number see page 49.
** Interfacial seal wafer; to complete order number see page 49.
*** High temperature version, interfacial seal wafer with stainless steel shell;
to complete order nunmber see page 49.
Shell
Size
9
11
13
15
17
19
21
23
25
N Dia.
+.001
–.005
.572
.700
.850
.975
1.100
1.207
1.332
1.457
1.582
SS Dia.
+.000
–.016
.662
.810
.960
1.085
1.210
1.317
1.442
1.567
1.692
L
+.011
–.000
.789
.789
.789
.789
.789
.789
.789
.821
.821
M
+.006
–.005
.125
.125
.125
.125
.125
.125
.125
.156
.156
GG Dia.
+.011
–.010
.750
.844
.969
1.094
1.218
1.312
1.438
1.563
1.688
KK Dia.
+.001
–.005
.672
.781
.906
1.031
1.156
1.250
1.375
1.500
1.625
All dimensions for reference only.
Weld mounting hermetic receptacle also available. Consult Amphenol,
Sidney, NY for availability and dimensions.
37
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