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EC2-B-S-24.000M

Description
CRYSTALS 50/100 0+70 SERIES 24.000MHZ BT CUT FUND HC-49/US
CategoryPassive components    Crystal/resonator   
File Size61KB,3 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Download Datasheet Parametric Compare View All

EC2-B-S-24.000M Overview

CRYSTALS 50/100 0+70 SERIES 24.000MHZ BT CUT FUND HC-49/US

EC2-B-S-24.000M Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerECLIPTEK
package instructionHC-49/US, 2 PIN
Reach Compliance Codeunknown
Other featuresBT-CUT; BULK
Ageing5 PPM/YEAR
Crystal/Resonator TypeSERIES - FUNDAMENTAL
Drive level1000 µW
frequency stability0.01%
frequency tolerance50 ppm
Installation featuresTHROUGH HOLE MOUNT
Nominal operating frequency24 MHz
Maximum operating temperature70 °C
Minimum operating temperature
physical sizeL11.18XB4.7XH3.68 (mm)/L0.44XB0.185XH0.145 (inch)
Series resistance40 Ω
surface mountNO

EC2-B-S-24.000M Preview

EC2-B-S-24.000M
EC2
Series
Resistance Welded HC-49/US Crystal
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over 0°C to +70°C
Mode of Operation
BT-Cut Fundamental
-B -S -24.000M
Nominal Frequency
24.000MHz
Load Capacitance
Series Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Storage Temperature Range
Insulation Resistance
24.000MHz
±50ppm at 25°C, ±100ppm over 0°C to +70°C
±5ppm/year Maximum
Series Resonant
7pF Maximum
40 Ohms Maximum
BT-Cut Fundamental
1mWatt Maximum
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-883, Method 2004
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
E24.000M
E=Ecliptek Designator
M=Frequency Unit of
Measure
6.35
MIN
DIA 0.457
±0.051(X2)
11.18
MAX
4.88 ±0.20
3.68 MAX
4.70
MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 1 of 3
EC2-B-S-24.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 2 of 3
EC2-B-S-24.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 3 of 3

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