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MT36JSZF51272PIY-1G0I

Description
DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240
Categorystorage    storage   
File Size886KB,21 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance  
Download Datasheet Parametric View All

MT36JSZF51272PIY-1G0I Overview

DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240

MT36JSZF51272PIY-1G0I Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeDIMM
package instructionDIMM,
Contacts240
Reach Compliance Codecompliant
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N240
JESD-609 codee4
memory density38654705664 bit
Memory IC TypeDDR DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals240
word count536870912 words
character code512000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGold (Au)
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperature30
4GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM
Features
DDR3 SDRAM RDIMM
MT36JSZF51272P – 4GB
For component data sheets, refer to Micron’s Web site:
www.micron.com
Features
• DDR3 functionality and operations supported as
defined in the component data sheet
• 240-pin, registered dual in-line memory module
(RDIMM)
• Heat spreader
• Fast data transfer rates: PC3-10600, PC3-8500,
or PC3-6400
• 4GB (512 Meg x 72)
• V
DD
= 1.5V ±0.075V
• V
DDSPD
= +3.0V to +3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Dual rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus
Figure 1:
240-Pin RDIMM (MO-269 R/C J)
PCB height: 30.0mm (1.181in)
U1
U2
U3
U4
U5
U6
U8
U9
U10
U11
U7
U12
U13
U14
U15
U16
U17
U18
U19
U20
Options
1
Marking
• Operating temperature
Commercial (0°C
T
A
+70°C)
None
Industrial (–40°C
T
A
+85°C)
I
• Package
240-pin DIMM
Y
• Frequency/CAS latency
1.5ns @ CL = 8 (DDR3-1333)
-1G5
1.5ns @ CL = 9 (DDR3-1333)
-1G4
2
1.5ns @ CL = 10 (DDR3-1333)
-1G3
1.87ns @ CL = 7 (DDR3-1066)
-1G1
1.87ns @ CL = 8 (DDR3-1066)
-1G0
2
2.5ns @ CL = 5 (DDR3-800)
-80C
2
2.5ns @ CL = 6 (DDR3-800)
-80B
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. Not recommended for new designs.
Table 1:
Speed
Grade
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Key Timing Parameters
Data Rate (MT/s)
Industry
Nomenclature
PC3-10600
PC3-10600
PC3-10600
PC3-8500
PC3-8500
PC3-6400
PC3-6400
CL = 10
1333
1333
1333
CL = 9
1333
1333
CL = 8
1333
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
800
800
CL = 5
800
800
t
RCD
t
RP
t
RC
(ns)
12
13.5
15
13.125
15
12.5
15
(ns)
12
13.5
15
13.125
15
12.5
15
(ns)
48
49.5
51
50.625
52.5
50
52.5
PDF: 09005aef830b8963/Source: 09005aef830b8b9a
JSZF36C512x72P.fm - Rev. A 3/08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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