Freescale Semiconductor
Advance Information
Document Number: MC33880
Rev. 7.0, 1/2009
Configurable Octal Serial Switch
with Serial Peripheral Interface
I/O
The 33880 device is an eight-output hardware-configurable high-
side/low-side switch with 8-bit serial input control. Two of the outputs
can be controlled directly via microcontroller for Pulse Width
Modulation (PWM) applications.
The 33880 controls various inductive or incandescent loads by
directly interfacing with a microcontroller.
The circuit's innovative monitoring and protection features include
very low standby currents, “cascadable” fault reporting, internal 40 V
output clamping for low-side configurations, internal -20 V output
clamping for high-side configurations, output-specific diagnostics, and
independent shutdown of outputs.
Features
• Designed to Operate 5.5 V < V
PWR
< 24.5 V
• 8-Bit SPI for Control and Fault Reporting, 3.3 V/ 5.0 V Compatible
• Outputs Are Current Limited (0.8 A to 2.0 A) to Drive
Incandescent Lamps
• Output Voltage Clamp Is +45 V (Typical) (Low-Side Drive) and -
20 V (Typical) (High-Side Drive) During Inductive Switching
• Internal Reverse Battery Protection on V
PWR
• Loss of Ground or Supply Will Not Energize Loads or Damage IC
• Maximum 5.0
μA
I
PWR
Standby Current at 13 V V
PWR
up to 95°C
• R
DS(ON)
of 0.55
Ω
at 25°C Typical
• Short Circuit Detect and Current Limit with Automatic Retry
• Independent Overtemperature Protection
• 32-Pin SOICW Has Pins 8, 9, 24, and 25 Grounded for Thermal
Performance
• Pb-Free Packaging Designated by Suffix Code EG and EW
V PWR
5.0 V
5.0 V
33880
HIGH/LOW-SIDE SWITCH
DW SUFFIX
EG SUFFIX (PB-FREE)
98ASB42345B
28-PIN SOICW
DWB SUFFIX
EW SUFFIX (PB-FREE)
98ARH99137A
32-PIN SOICW
ORDERING INFORMATION
Device
MC33880DW/R2
MCZ33880EG/R2
MC33880DWB/R2
MCZ33880EW/R2
28 SOICW
-40
°
C to 125
°
C
32 SOICW
Temperature
Range (T
A
)
Package
33880
VPWR
VDD
D1
D2
D3
D4
D5
D6
D7
D8
S1
S2
S3
S4
S5
S6
S7
S8
VS
High-Side
EN
MCU
SPI I/O
CS
SCLK
DI
DO
IN5
IN6
GND
MOT
H-Bridge
PWM
Low-Side
All Output Switches are High- or Low-Side Configurable
Figure 1. 33880 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
__
CS
SCLK
DI
DO
OV, POR, SLEEP
~50
μA
VPWR
Overvoltage
Shutdown/POR
Sleep State
Internal
Bias
Charge
Pump
GND
EN
~50
μA
SPI and
Interface
Logic
SPI Bit 0
Typical of All 8 Output Drivers
TLIM
IN5
~50
μA
Enable
SPI Bit 4
Gate
Drive
Control
Current
Limit
Open
Load
Detect
Current
~650
μA
D1
D2
D3
D4
D7
D8
S1
S2
S3
S4
S7
S8
Drain
Outputs
IN6
~50
μA
IN5
+
–
+
–
Open/Short Comparator
+
_
~1.5 V Open/Short Threshold
Source
Outputs
TLIM
Gate
Drive
Control
Current
Limit
Open
Load
Detect
Current
~650
μA
D5
D6
Drain
Outputs
+
–
+
–
Open/Short Comparator
+
_
S5
S6
Source
Outputs
~1.5 V Open/Short Threshold
Figure 2. 33880 Simplified Internal Block Diagram
33880
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
GND
VDD
S8
S8
D8
S2
D2
S1
D1
D6
S6
IN6
EN
SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DO
VPWR
S7
S7
D7
S4
D4
S3
D3
D5
S5
IN5
CS
DI
Figure 3. 28-Pin Connections
Table 1. SOICW 28-Pin Definitions
Pin
Number
1
2
3, 4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25, 26
27
28
Pin Name
GND
VDD
S8
D8
S2
D2
S1
D1
D6
S6
IN6
EN
SCLK
DI
CS
IN5
S5
D5
D3
S3
D4
S4
D7
S7
VPWR
DO
Digital ground.
Logic supply voltage. Logic supply must be switched off for low current mode (V
DD
below 3.9 V).
Output 8 MOSFET source pins.
Output 8 MOSFET drain pin.
Output 2 MOSFET source pin.
Output 2 MOSFET drain pin.
Output 1 MOSFET source pin.
Output 1 MOSFET drain pin.
Output 6 MOSFET drain pin.
Output 6 MOSFET source pin.
PWM direct control input pin for output 6. IN6 is “OR” with SPI bit.
Enable input. Allows control of outputs. Active high.
SPI control clock input pin.
SPI control data input pin from MCU to the 33880. Logic [1] activates output.
SPI control chip select input pin from MCU to the 33880. Logic [0] allows data to be transferred in.
PWM direct control input pin for output 5. IN5 is “OR” with SPI bit.
Output 5 MOSFET source pin.
Output 5 MOSFET drain pin.
Output 3 MOSFET drain pin.
Output 3 MOSFET source pin.
Output 4 MOSFET drain pin.
Output 4 MOSFET source pin.
Output 7 MOSFET drain pin.
Output 7 MOSFET source pins.
Power supply pin to the 33880. VPWR has internal reverse battery protection.
SPI control data output pin from the 33880 to the MCU. DO = 0 no fault, DO = 1 specific output has fault.
Definition
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
GND
VDD
S8
S8
D8
S2
D2
TGND
TGND
S1
D1
D6
S6
IN6
EN
SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
DO
VPWR
S7
S7
D7
S4
D4
TGND
TGND
S3
D3
D5
S5
IN5
CS
DI
Figure 4. 32-Pin Connections
Table 2. SOICW 32-Pin Definitions
Pin
Number
1
2
3, 4
5
6
7
8, 9, 24, 25
10
11
12
13
14
15
16
17
18
19
20
21
22
23
26
27
28
29, 30
31
32
Pin Name
GND
VDD
S8
D8
S2
D2
TGND
S1
D1
D6
S6
IN6
EN
SCLK
DI
CS
IN5
S5
D5
D3
S3
D4
S4
D7
S7
VPWR
DO
Digital ground.
Logic supply voltage. Logic supply must be switched off for low current mode (V
DD
below 3.9 V).
Output 8 MOSFET source pins.
Output 8 MOSFETdrain pin.
Output 2 MOSFET source pin.
Output 2 MOSFET drain pin.
Thermal Ground pins are connected internally to the substrate of the die and are used for heat transfer.
Connect thermal ground pins to the PCB ground and ground plane for heat sinking.
Output 1 MOSFET source pin.
Output 1 MOSFET drain pin.
Output 6 MOSFETdrain pin.
Output 6 MOSFET source pin.
PWM direct control input pin for output 6. IN6 is “OR” with SPI bit.
Enable input. Allows control of outputs. Active high.
SPI control clock input pin.
SPI control data input pin from MCU to the 33880. Logic [1] activates output.
SPI control chip select input pin from MCU to the 33880. Logic [0] allows data to be transferred in.
PWM direct control input pin for output 5. IN5 is “OR” with SPI bit.
Output 5 MOSFET source pin.
Output 5 MOSFET drain pin.
Output 3 MOSFET drain pin.
Output 3 MOSFET source pin.
Output 4 MOSFET drain pin.
Output 4 MOSFET source pin.
Output 7 MOSFET drain pin.
Output 7 MOSFET source pins.
Power supply pin to the 33880. VPWR has internal reverse battery protection.
SPI control data output pin from the 33880 to the MCU. DO = 0 no fault, DO = 1 specific output has fault.
Definition
33880
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
VDD Supply Voltage
(1)
CS, DI, DO, SCLK, IN5, IN6, and EN
(1)
VPWR Supply Voltage
(1)
Drain 1 – 8
(2)
5.0 mA
≤
I
OUT
≤
0.3 A
Source 1 – 8
(3)
5.0 mA
≤
I
OUT
≤
0.3 A
Output Voltage Clamp Low-Side Drive
(4)
Output Voltage Clamp High-Side Drive
(4)
Output Clamp Energy
(5)
ESD Voltage
(6)
Human Body Model
Machine Model
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Maximum Junction Temperature
Power Dissipation (T
A
= 25
°
C)
(7)
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
Peak Package Reflow Temperature During Reflow
(8)
,
(9)
Notes
1.
2.
3.
4.
5.
6.
7.
8.
9.
R
θJA
R
θJA
R
θJL
T
PPRT
V
ESD1
V
ESD2
T
STG
T
C
T
J
–
P
D
1.3
1.7
94
70
18
Note 9
°C
±2000
±200
-55 to 150
-40 to 125
-40 to 150
-40 to 150
V
OC
V
OC
E
CLAMP
–
-28 to 40
40 to 55
-15 to -25
50
V
DC
V
DC
mJ
V
Symbol
V
DD
–
V
PWR
–
-18 to 40
V
DC
Value
-0.3 to 7.0
-0.3 to 7.0
-16 to 50
Unit
V
DC
V
DC
V
DC
V
DC
°
C
°
C
°
C
°
C
W
°
C/W
°
C/W
Exceeding these limits may cause malfunction or permanent damage to the device.
Configured as low-side driver with 300 mA load as current limit.
Configured as high-side driver with 300 mA load as current limit.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
Maximum output clamp energy capability at 150
°
C junction temperature using single non-repetitive pulse method.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω),
and ESD2 testing is performed
in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
Ω).
Maximum power dissipation with no heatsink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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