Standard SRAM, 16KX4, 12ns, CMOS, CQCC22, 0.290 X 0.490 INCH, CERAMIC, LCC-22
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | LOGIC Devices |
| Parts packaging code | LCC |
| package instruction | QCCN, LCC22,.3X.5 |
| Contacts | 22 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 12 ns |
| Other features | AUTOMATIC POWER-DOWN |
| I/O type | COMMON |
| JESD-30 code | R-CQCC-N22 |
| JESD-609 code | e0 |
| length | 12.446 mm |
| memory density | 65536 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 22 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16KX4 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC22,.3X.5 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Maximum seat height | 3.048 mm |
| Maximum standby current | 0.00025 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.145 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.366 mm |
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