L6116LCM25 datasheet, PDF - EEWORLD Datasheet

L6116LCM25: DescriptionStandard SRAM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24; Categorystorage storage; File Size767KB，7 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L6116LCM25 Overview

Standard SRAM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24

Parameter Name	Attribute value
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	R-GDIP-T24
length	31.75 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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