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SP2525NUTG

Description
Trans Voltage Suppressor Diode,
CategoryDiscrete semiconductor    diode   
File Size828KB,5 Pages
ManufacturerIXYS
Environmental Compliance
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SP2525NUTG Overview

Trans Voltage Suppressor Diode,

SP2525NUTG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIXYS
Reach Compliance Codecompliant

SP2525NUTG Preview

®
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection-
SP2525NUTG
SP3384NUTG
SP2525NUTG, 2.5V, 30A Diode Array
Description
RoHS
Pb
GREEN
The SP2525NUTG is a low-capacitance, TVS Diode Array
designed to provide protection against ESD (electrostatic
discharge), CDE (cable discharge events), EFT (electrical
fast transients), and lightning induced surges for
highspeed, differential data lines. It’s packaged in a μDFN
package (3.0 x 2.0mm) and each device can protect up 4
channels up to 30A (IEC 61000-4- 5 2
nd
edition,) and up to
±30kV ESD (IEC 61000-4-2).
The SP2525NUTG with its low capacitance and low
clamping voltage makes it ideal for high-speed data
interfaces such as 1GbE applications found in notebooks,
switches, etc.
Pinout
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
10
9
8
7
6
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, IEC 61000-
4-5 2
nd
edition, 30A
(t
P
=8/20μs)
• Low capacitance of
1.7pF@0V (TYP)
NC
NC
NC
NC
• μDFN-10 package is
optimized for high-speed
data line routing
• Provides protection for
two differential data pairs
(4 channels) up to 30A
• Halogen free, Lead free
and RoHS compliant
• Moisture Sensitivity Level
(MSL -1)
GND
GND
GND
1
2
3
4
5
• Low leakage current of
1nA (TYP) at 2.5V
• Low operating and
clamping voltage
Applications
•10/100/1000 Ethernet
• WAN/LAN Equipment
• Desktops, Servers and
Notebooks
Note: PIN3 and PIN8 are same potential with GND
Top View
Functional Block Diagram
• LVDS Interfaces
• Integrated Magnetics
• Smart TV
• 2.5G/5G/10G Ethernet
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/18/19
®
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection-
SP2525NUTG
SP3384NUTG
Absolute Maximum Ratings
Symbol
I
PP
T
OP
T
STOR
Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and
operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Parameter
Peak Current (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Value
30
-40 to 125
-55 to 150
Units
A
°C
°C
Electrical Characteristics
(T
OP
=25ºC)
Parameter
Reverse Standoff Voltage
Breakdown Voltage
Reverse Leakage Current
Holding Voltage
Clamp Voltage
1
Dynamic Resistance
2
ESD Withstand Voltage
1,3
Diode Capacitance
1
Symbol
V
RWM
V
BR
I
LEAK
V
HOLD
V
C
R
DYN
V
ESD
C
I/O-GND
Test Conditions
I
R
= 1μA
I
R
= 1mA
V
R
=2.5V
I/O to GND
I
PP
=30A, t
p
=8/20μs
TLP t
p
=100ns
,
IEC 61000-4-2 (Contact Discharge)
IEC 61000-4-2 (Air Discharge)
Reverse Bias=0V, f=1MHz
±30
±30
1.7
2.5
5.5
7
.0
1
1.6
9
0.14
11
100
Min
Typ
Max
2.5
Units
V
V
nA
V
V
Ω
kV
kV
pF
Notes:
1Parameter is guaranteed by design and/or component characterization.
2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: start t1=70ns to end t2=90ns
3. Device stressed with ten non-repetitive ESD pulses.
8/20μs Pulse Waveform
110%
100%
90%
80%
Capacitance vs. Reverse Bias
2.5
2.0
1.5
1.0
0.5
0.0
Percent of I
PP
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Capacitance (pF)
0.0
Time ( s)
0.5
1.0
1.5
2.0
2.5
Bias Voltage (V)
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/18/19
®
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection-
SP2525NUTG
SP3384NUTG
Positive Transmission Line Pulsing (TLP) Plot
25
20
15
10
5
0
Negative Transmission Line Pulsing (TLP) Plot
0
-5
-10
-15
-20
TLP Current (A)
0
2
4
6
8
10
12
14
16
TLP Current (A)
-25
TLP Voltage (V)
-5
-4
-3
-2
TLP Voltage (V)
-1
0
Clamping Voltage vs. Peak Pulse Current
12.0
Clamp Voltage – Vc (V)
10.0
8.0
6.0
4.0
2.0
0.0
0.0
5.0
10.0
15.0
20.0
Peak Pulse Current -I PP (A)
25.0
30.0
IEC 61000−4−2 +8 kV Contact ESD Clamping Voltage
IEC 61000−4−2 -8 kV Contact ESD Clamping Voltage
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/18/19
®
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection-
SP2525NUTG
SP3384NUTG
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus) Temp (T
L
)
to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
Temperature
T
P
T
L
T
S(max)
Preheat
Ramp-up
t
P
Critical Zone
T
L
to T
P
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
t
L
Ramp-do
Ramp-down
T
S(min)
t
S
time to peak temperature
25
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
°C
Time
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Product Characteristics
Lead Plating
Lead Material
PPF
Copper Alloy
Silicon
Molded Compound
UL Recognized compound meeting
flammability rating V-0
Ordering Information
Part Number
SP2525NUTG
Package
μDFN-10 (3.0x2.0mm)
Min. Order Qty.
3000
Substrate Material
Body Material
Flammability
Part Marking System
Part Numbering System
SP2525N U T G
SP2525
GYYWW
First row = Part name = SP2525NUTG
Second row = Assembly code + Date Code
TVS Diode Arrays
(SPA
®
Diodes)
Series
G= Green
T= Tape & Reel
Package
DFN-10 (3.0x2.0mm)
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/18/19
®
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection-
SP2525NUTG
SP3384NUTG
Package Dimensions - μDFN-10 (3.0x2.0mm)
D
10
6
6
E2
10
e
e1
e1
e
Symbol
A
A1
A2
5
L
1
Millimeters
Min
0.50
0.00
0.15
2.90
1.90
0.25
0.90
0.20
Nom
0.55
0.02
0.15 Ref
0.20
3.00
2.00
0.35
1.00
0.30
0.60 BSC
0.65 BSC
0.95 BSC
0.25
3.10
2.10
0.45
1.10
0.40
0.006
0.114
0.075
0.010
0.035
0.008
Max
0.60
0.05
Min
0.020
0.000
Inches
Nom
0.022
0.001
0.006 Ref
0.008
0.118
0.079
0.014
0.039
0.012
0.024 BSC
0.026 BSC
0.037 BSC
0.010
0.122
0.083
0.018
0.043
0.016
Max
0.024
0.002
E
b
D
E
D2
E2
0.25mm
1
Top View
5
D2
e2
b
Bottom View
A1
0.95mm
0.95mm
L
e
e1
e2
A2
Side View
A
2.60mm
1.00mm
1
0.60mm 0.65mm 0.65mm 0.60mm
Recommended Soldering Layout
(Drawing# : U05-A)
Tape & Reel Specification — µDFN-10 (3.0x2.0mm)
P0
P2
ø1.55±0.05
E
Top
Cover
Tape
5° Max
W
A0
B0
F
Package
µDFN-10 (3.0x2.0mm)
Millimeters
2.30 +/- 0.10
3.20 +/- 0.10
1.75 +/- 0.10
3.50 +/- 0.05
1.0 +/- 0.10
4.00 +/- 0.10
4.00 +/- 0.10
2.00 +/- 0.10
0.3 +/- 0.05
8.00 +0.30/- 0.10
T
Device Orientation in Tape
0.60mm
0.40mm
1.40mm
Symbol
A0
B0
E
F
K0
P
K0
P
ø1.0±0.1
Pin1 Location
P0
P2
T
W
,Ref.
,Ref.
,Ref.
8mm TAPE AND REEL
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at
http://www.littelfuse.com/disclaimer-electronics.
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/18/19
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