LSI53C875EP3 datasheet, PDF - EEWORLD Datasheet

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LSI53C875EP3: DescriptionSCSI Bus Controller, CMOS, PQFP160, 32 MM, PLASTIC, QFP-160; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，328 Pages; ManufacturerLSC/CSI; Websitehttps://lsicsi.com

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LSI53C875EP3 Overview

SCSI Bus Controller, CMOS, PQFP160, 32 MM, PLASTIC, QFP-160

LSI53C875EP3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LSC/CSI
Parts packaging code	QFP
package instruction	QFP,
Contacts	160
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Address bus width	32
Bus compatibility	PCI
maximum clock frequency	33.33 MHz
Maximum data transfer rate	40 MBps
Drive interface standards	X3.131
External data bus width	32
JESD-30 code	S-PQFP-G160
JESD-609 code	e0
length	28 mm
Number of terminals	160
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	4.01 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	28 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, SCSI

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TECHNICAL

MANUAL

LSI53C875/875E

PCI to Ultra SCSI

I/O Processor

Version 4.1

March 2001

S14063

LSI53C875EP3 Related Products

	LSI53C875EP3	LSI53C875EGV	LSI53C875GV	LSI53C875P3
Description	SCSI Bus Controller, CMOS, PQFP160, 32 MM, PLASTIC, QFP-160	SCSI Bus Controller, CMOS, PBGA169, 23 X 23 MM, 1.50 MM PITCH, PLASTIC, BGA-169	SCSI Bus Controller, CMOS, PBGA169, 23 X 23 MM, 1.50 MM PITCH, PLASTIC, BGA-169	SCSI Bus Controller, CMOS, PQFP160, 32 MM, PLASTIC, QFP-160
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFP	BGA	BGA	QFP
package instruction	QFP,	BGA,	BGA,	QFP,
Contacts	160	169	169	160
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Address bus width	32	32	32	32
Bus compatibility	PCI	PCI	PCI	PCI
maximum clock frequency	33.33 MHz	33.33 MHz	33.33 MHz	33.33 MHz
Maximum data transfer rate	40 MBps	40 MBps	40 MBps	40 MBps
Drive interface standards	X3.131	X3.131	X3.131	X3.131
External data bus width	32	32	32	32
JESD-30 code	S-PQFP-G160	S-PBGA-B169	S-PBGA-B169	S-PQFP-G160
JESD-609 code	e0	e0	e0	e0
length	28 mm	23 mm	23 mm	28 mm
Number of terminals	160	169	169	160
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	BGA	BGA	QFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	GRID ARRAY	GRID ARRAY	FLATPACK
Peak Reflow Temperature (Celsius)	225	225	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.01 mm	2.4 mm	2.4 mm	4.01 mm
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	GULL WING	BALL	BALL	GULL WING
Terminal pitch	0.65 mm	1.5 mm	1.5 mm	0.65 mm
Terminal location	QUAD	BOTTOM	BOTTOM	QUAD
Maximum time at peak reflow temperature	30	30	30	30
width	28 mm	23 mm	23 mm	28 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, SCSI	BUS CONTROLLER, SCSI	BUS CONTROLLER, SCSI	BUS CONTROLLER, SCSI

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